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CPZ19 Datasheet - Central-Semiconductor

Part Name
Description
MFG CO.
CPZ19
Central-Semiconductor
Central Semiconductor Central-Semiconductor
Other PDF
  2002  
PDF
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CPZ19 image

PROCESS DETAILS
   Process EPITAXIAL PLANAR
   Die Size 17.7 x 17.7 MILS
   Die Thickness 7.5 MILS
   Anode Bonding Pad Area 11 x 11 MILS
   Top Side Metalization Al - 13,000Å
   Back Side Metalization Au - 14,000Å

 

Part Name
Description
PDF
MFG CO.
Zener Diode 0.5 Watt Zener Diode Chip
Central Semiconductor
Zener Diode 0.5 Watt Zener Diode Chip
Central Semiconductor
Zener Diode 0.5 Watt Zener Diode Chip ( Rev : 2002 )
Central Semiconductor
Chip Zener Diode
Formosa Technology
Chip Zener Diode
Formosa Technology
Chip Zener Diode
Formosa Technology
Chip Zener Diode
Formosa Technology
1 WATT ZENER DIODE
Frontier Electronics.
500m WATT ZENER DIODE
Frontier Electronics.
50 Watt Zener Diode
American Microsemiconductor

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