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EGF1T Datasheet

Part NameDescriptionManufacturer
EGF1T Surface Mount Glass Passivated Ultrafast Rectifier TAYCHIPST
Shenzhen Taychipst Electronic Co., Ltd TAYCHIPST
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FEATURES
• Cavity-free glass-passivated junction
• Ideal for automated placement
• Ultrafast reverse recovery time
• Low switching losses, high efficiency
• Avalanche surge energy capability
• Meets environmental standard MIL-S-19500
• Meets MSL level 1, per J-STD-020, LF maximum peak of 250 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

 

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