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WED3C7410E16M400BH9C Datasheet

Part Name
Description
MFG CO.
WED3C7410E16M400BH9C
WEDC
White Electronic Designs Corporation WEDC
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OVERVIEW
The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.

The WED3C7410E16M-XBHX multichip package consists of:
■ 7410E AltiVec™ RISC processor
■ Dedicated 2MB SSRAM L2 cache, confi gured as 256Kx72
■ 21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA)
■ Core frequency = 450 or 400MHz @ 1.8V
■ Maximum L2 Cache frequency = 200MHz
■ Maximum 60x Bus frequency = 100MHz

FEATURES
■ Footprint compatible with WED3C7410E16M-XBX, WED3C7558M-XBX and WED3C750A8M-200BX
■ Implementation of Altivec™ technology instruction set
■ Optional, high-bandwidth MPX bus interface
■ HiTCE™ interposer for TCE compatibility to laminate substrates for increased Board level reliability
■ Available with eutectic or high lead solder balls

 

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