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XE5692H Datasheet

Part Name
Description
MFG CO.
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Description
The Xecom XE5692H is a complete, global modem in a compact, surface-mount module. It covers less than half the board space of the leading competitor and is less than half as thick as well.

Features
• Models: XE5692H: 0 to 70C operating temp XE5692H-ITR: -40 to 85C operating temperature
• Size: 1.6” x 0.8” x 0.152”
• Data transfer at rates from 300 bps to 56 Kbps
• Control & configuration via AT commands.
• 3.3 and 5 volt compatible serial interface
• V.42 error control and V.42bis data compression.
• Shared line features prevent modem operation from interfering with voice communications.
• Boot command automatically loads user defaults
• Complete integrated DAA.
• User transferrable FCC Part 68 registration
• World-wide telephone networks compliance.
• UL60950 Recognition
• Low Power operation, 3.3 Volts, 100 milliwatts;
• RoHS compliant

 

Part Name
Description
PDF
MFG CO.
Half-Size, Low-Cost Global Embedded Modem
Unspecified
Half-size Wallmount Chassis with 4-slot Backplane, 80W P/S Provides PICMG1.3 Half-size Backplane
BOSER Technology Co., Ltd
Half-size Wallmount Chassis with 4-slot Backplane, 180W ATX P/S Provides PICMG1.3 Half-size Backplane
BOSER Technology Co., Ltd
Low-Cost, 2400 BPS Surface-Mount Modem
Unspecified
Low-Cost, Embeddable 33,600 BPS Modem Module
Unspecified
Low Cost 5 REN Ringing SLIC for ISDN Modem/TA and WL
Intersil
Low Cost 3 REN Ringing SLIC for ISDN Modem/TA and WL
Intersil
Half-size Deskmount Chassis with 6-slot Backplane, 70W/100W P/S Provides PICMG1.3 Half-size Backplane
BOSER Technology Co., Ltd
100V/1A Peak, Low Cost, High Frequency Half Bridge Driver
Intersil
MODEM CONTROLLER IDEAL FOR LOW POWER CONSUMPTION, SMALL SIZE REQUIREMENTS
Zilog

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