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Part name(s)' : 7404 74LS04 74LS04P 74LS05 74LS05P HD74LS04 HD74LS04FPEL HD74LS04P HD74LS04RPEL HD74LS05 HD74LS05FP HD74LS05FPEL HD74LS05P HD74LS05RP HD74LS05RPEL HD74LS04FP HD74LS04RP
Description : HEX INVERTERS / HEX INVERTERS (with Open Collector Outputs)
Renesas
Renesas Electronics

HEX INVERTERS / HEX INVERTERS (with Open Collector Outputs)

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Part name(s)' : SNJ5405W SNJ5405J
Description : HEX INVERTERS WITH OPEN-COLLECTOR OUTPUTS
TI
Texas Instruments

HEX INVERTERS WITH OPEN-COLLECTOR OUTPUTS

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Part name(s)' : MC54F13 MC54F13J MC54F14 MC54F14J MC74F13 MC74F13D MC74F13N MC74F14 MC74F14D MC74F14N
Description : SCHMITT TRIGGERS DUAL 4-INPUT NAND/HEX INVERTERS
Motorola
Motorola => Freescale

SCHMITT TRIGGERS DUAL 4-INPUT NAND/HEX INVERTERS FAST™ SCHOTTKY TTL



The MC54/74F13 and MC54/74F14 contain logic gates/INVERTERS which accept standard TTL input signals and provide standard TTL output levels. They arecapable of transforming slowly changing input signals into sharply defined, jitter-free output signals. Additionally, they have greater noise margin than conventional INVERTERS.


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Part name(s)' : 74AC04 74AC05 74ACT04 74ACT05 CD74ACT04 CD74ACT04E CD74ACT04M
Description : HEX INVERTERS
TI
Texas Instruments

The CD74AC04, CD74ACT04, CD74AC05 and CD74ACT05 are HEX INVERTERS that utilize the Harris Advanced CMOS Logic technology.




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Part name(s)' : IN74HCU04A IN74HCU04AD IN74HCU04AN
Description : HEX Unbuffered INVERTERS
IKSEMICON
IK Semicon Co., Ltd

HEX Unbuffered INVERTERS

High-Performance Silicon-Gate CMOS



The IN74HCU04A is identical in pinout to the 74LS04. This contain six independent unbuffered INVERTERS. These INVERTERS are well suited for use as oscillators, pulse shapers and in many other applications requiring a high-input impedance amplifier.

This device is characterized for over wide temperature ranges to meet industry and ation over military specifications.



• Low Power consumption characteristic of CMOS devices

• Output drive capability: 10 LS TTL Loads Min.

• Operating speed superior to LS TTL

• Wide operating voltage range: 2.0 to 6.0 V

• Low input current: 1.0 μA Max.

• Low quiescent current: 20μA Max.

• High noise immunity characteristic of CMOS

• Diode protection on all inputs



 


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Part name(s)' : SN54LV04A SN54LV04AFK SN54LV04AJ SN54LV04APW SN54LV04AW SNJ54LV04AFK SNJ54LV04AJ SNJ54LV04AW
Description : HEX INVERTERS
TI
Texas Instruments

description/ordering information

These HEX INVERTERS are designed for 2-V to 5.5-V VCC operation. The ’LV04A devices contain six independent INVERTERS. These devices perform the Boolean function Y = A.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down.



● 2-V to 5.5-V VCC Operation

● Max tpd of 6.5 ns at 5 V

● Latch-Up Performance Exceeds 250 mA Per JESD 17

● Typical VOLP (Output Ground Bounce)

   <0.8 V at VCC = 3.3 V, TA = 25°C

● Typical VOHV (Output VOH Undershoot)

   >2.3 V at VCC = 3.3 V, TA = 25°C

● Support Mixed-Mode Voltage Operation on All Ports

● Ioff Supports Partial-Power-Down Mode Operation

● ESD Protection Exceeds JESD 22

   − 2000-V Human-Body Model (A114-A)

   − 200-V Machine Model (A115-A)

   − 1000-V Charged-Device Model (C101)



 


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Part name(s)' : SN74LVC14
Description : HEX SCHMITT-TRIGGER INVERTERS
TI
Texas Instruments

DESCRIPTION
The SN54LVC14A HEX Schmitt-trigger inverter is designed for 2.7-V to 3.6-V VCC operation, and the SN74LVC14A HEX Schmitt-trigger inverter is designed for 1.65-V to 3.6-V VCC operation.

Operate From 1.65 V to 3.6 V
Specified From –40°C to 85°C, –40°C to 125°C, and –55°C to 125°C
Inputs Accept Voltages to 5.5 V
Max tpdof 6.4 ns at 3.3 V
Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA= 25°C
Typical VOHV(Output VOHUndershoot)> 2 V at VCC= 3.3 V, TA= 25°C
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)

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Part name(s)' : SN74ALS05ADBR SN74ALS05ADBRE4 SN74ALS05ADE4 SN74ALS05AN3 SN74ALS05ANSRE4 SN74ALS05ADBLE
Description : HEX INVERTERS WITH OPEN-COLLECTOR OUTPUTS
TI
Texas Instruments

description
These devices contain six independent HEX INVERTERS with open-collector outputs. They perform the Boolean function Y = A. The open-collector outputs require pullup resistors to perform correctly. These outputs can be con nected to other open-collector outputs to implement active-low wired-OR or active-high wired-AND functions. Open-collector devices are often used to generate higher VOH levels.
The SN54ALS05A is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ALS05A is characterized for operation from 0°C to 70°C.

• Package Options Include Plastic
   Small-Outline (D) Packages, Ceramic Chip
   Carriers (FK), and Standard Plastic (N) and
   Ceramic (J) 300-mil DIPs

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Part name(s)' : SN54LV04 SN54LV04FK SN54LV04J SN54LV04W SN74LV04 SN74LV04D SN74LV04DB SN74LV04DBLE SN74LV04DR SN74LV04PW SN74LV04PWLE
Description : HEX INVERTERS
TI
Texas Instruments

description

These HEX INVERTERS are designed for 2.7-V to 5.5-V VCC operation.

The ’LV04 contain six independent INVERTERS. These devices perform the Boolean function Y = A.

The SN74LV04 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LV04 is characterized for operation over the full military temperature range of −55°C to 125°C. The SN74LV04 is characterized for operation from −40°C to 85°C.



● EPIC™ (Enhanced-Performance Implanted CMOS) 2-µ Process

● Typical VOLP (Output Ground Bounce)

   < 0.8 V at VCC, TA = 25°C

● Typical VOHV (Output VOH Undershoot)

   > 2 V at VCC, TA = 25°C

● ESD Protection Exceeds 2000 V Per

   MIL-STD-883C, Method 3015; Exceeds

   200 V Using Machine Model

   (C = 200 pF, R = 0)

● Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17

● Package Options Include Plastic

   Small-Outline (D), Shrink Small-Outline

   (DB), Thin Shrink Small-Outline (PW), and

   Ceramic Flat (W) Packages, Ceramic Chip

   Carriers (FK), and Ceramic (J) 300-mil DIPs



 


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