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Features
• High physical separation between adjacent contacts
• Cadmium Free contact materials
• 8 mm, 6 kV (1.2/50 µs) isolatio, coil-contacts
• Flux proof: RT II
• 2 Pole 8 A
• 5 mm pinning
• PCB mounting

FEATURES
1. Lineup now includes High breakdown voltage type that achieves breakdown voltage
   between open contacts of 1.500 VAC.
      Surge breakdown voltage between open contacts:
         1.500 V 10 × 160 µsec. (FCC part 68)
      Surge breakdown voltage between contact and coil:
         6,000 V 1.2 × 50 µsec. (EN60950)
2. Approved to the supplementary insulation class in the EN standards(EN60950).
   The insulation distance between the
   contact and coil meet the
   supplementary insulation class of the
   EN60950 standards as required for
   equipment connected to the telephone
   lines in Europe.
   Satisfies the following conditions:
      • Clearances: 2.0 mm .079 inch or more
      • Creepage distance: 2.5 mm .098 inch or more
3. 3,000 V breakdown voltage between
   contact and coil. (Surge breakdown voltage 6,000 V type)
   The body block construction of the coil
   that is sealed formation offers a High
   breakdown voltage of 3,000 V between
   contact and coil.
4. Nominal operating power:
   High sensitivity of 200mW
   By using the Highly efficient polar
   magnetic circuit “seesaw balance
   mechanism”, a nominal operating
   power of 200 mW has been achieved.
5. High contact capacity: 2 A 30 V DC
6. High contact reliability achieved with gold-clad crossbar
   twin contacts and the use of gas expelling materials during formation.
      *We also offer a range of products with
         AgPd contacts suitable for use in low
         level load analog circuits (Max. 10V DC 10 mA).
      *SX relays designed for low level loads are also available.
         (Surge breakdown voltage 2,500 V type only)
7. Outstanding vibration and shock resistance.
   Functional shock resistance: 750 m/s2
   Destructive shock resistance: 1,000 m/s2
   Functional vibration resistance:
      10 to 55 Hz (at double amplitude of 3.3 mm .130 inch)
   Destructive vibration resistance:
      10 to 55 Hz (at double amplitude of 5 mm .197 inch)
8. Sealed construction allows automatic washing.
9. A range of surface-mount types is also available.
   SA: Low-profile surface-mount terminal type
   SL: High connection reliability surface mount terminal type
   SS: Space saving surface-mount terminal type
10. M.B.B. type available (Surge breakdown voltage 2,500 V type only)

TYPICAL APPLICATIONS
1. Facsimile
2. Modem
3. Communications (xDSL)
4. Medical equipment
5. Automotive equipment
6. Security

Description: 1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower™ Header, Right Angle, 4 Power contacts, 32 Signal contacts, Select Gold (Au) Plating, for 3.18mm (.1.5") Thick PC Board

BVCBO 1500 V
IC 6 A
VCE(sat) 5 V(max)
tf 1 μs(max)

FEATURES
● 3DD1.56 is High breakdown voltage of NPN bipolar transistor. The main process of manufacture: High voltage mesa type process, triple diffused process etc., adoption of fully plastic packge. RoHS product.

APPLICATIONS
● Horizontal deflection output for color TV.

FEATURES
• breakdown voltage between contacts and coil: 2,000 V
• Surge withstand between contacts and coil: 2,500 V
• High contact capacity: 2 A 30 V DC
• Surface-mount type available

DESCRIPTION/ORDERING INFORMATION
The AM26LV32E consists of quadruple differential line receivers with 3-state outputs. These differential receivers have ±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge) protection for RS422 bus pins.
This device is designed to meet TIA/EIA-422-B and ITU recommendation V.11 drivers with reduced supply voltage. The device is optimized for balanced bus transmission at switching rates up to 32 MHz. The 3-state outputs permit connection directly to a bus-organized system.
The AM26LV32E has an internal fail-safe circuitry that prevents the device from putting an unknown voltage signal at the receiver outputs. In the open fail-safe, shorted fail-safe, and terminated fail-safe, a High state is produced at the respective output.
This device is supported for partial-power-down applications using Ioff. Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The AM26LV32EM is characterized for operation from –55°C to 1.5°C.

FEATURES
• Meets or Exceeds Standard TIA/EIA-422-B and
   ITU Recommendation V.11
• Operates From a Single 3.3-V Power Supply
• ESD Protection for RS422 Bus Pins
   – ±15-kV Human-Body Model (HBM)
   – ±8-kV IEC61000-4-2, Contact Discharge
   – ±15-kV IEC61000-4-2, Air-Gap Discharge
• Switching Rates up to 32 MHz
• Low Power Dissipation: 27 mW Typ
• open-Circuit, Short-Circuit, and Terminated
   Fail-Safe
• ±7-V Common-Mode Input voltage Range With
   ±200-mV Sensitivity
• Accepts 5-V Logic Inputs With 3.3-V Supply
   (Enable Inputs)
• Input Hysteresis: 35 mV Typ
• Pin-to-Pin Compatible With AM26C32,
   AM26LS32
• Ioff Supports Partial-Power-Down Mode
   Operation

SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• available in Military (–55°C/1.5°C)
   Temperature Range (1)
• Extended Product Life Cycle
• Extended Product-Change Notification
• Product Traceability

description/ordering information

These TTL hex buffers/drivers feature High-voltage open-collector outputs for interfacing

with High-level circuits (such as MOS) or for driving High-current loads (such as lamps or

relays) and also are characterized for use as buffers for driving TTL inputs. The SN5407 and

SN7407 have minimum breakdown voltages of 30 V, and the SN5417 and SN7417 have

minimum breakdown voltages of 15 V. The maximum sink current is 30 mA for the SN5407

and SN5417 and 40 mA for the SN7407 and SN7417.

These devices perform the Boolean function Y = A in positive logic.

Convert TTL voltage Levels to MOS Levels

High Sink-Current Capability

Input Clamping Diodes Simplify System Design

open-Collector Driver for Indicator Lamps and Relays

Inputs Fully Compatible With Most TTL Circuits

FEATURES

• breakdown voltage between contacts and coil: 2,000 V

• Surge withstand between contacts and coil: 2,500 V

• High contact capacity: 2 A 30 V DC

• Surface-mount type available

Hex Inverter Buffers/Drivers with open-Collector High-voltage Outputs

The IN7406 monolithic TTL hex inverter buffers/drivers feature High-voltage open collector outputs for interfacing with High-level circuits (such as MOS) or for driving High-current loads (such as lamps or relays), and are also characterized for use as inverter buffers for driving TTL inputs.

·  Minimum breakdown voltages is 30 V

·  Maximum sink Current is 40 mÀ

·  Converts TTL voltage Levels to MOS Levels

·  open-Collector Driver for Indicator Lamps and Relays

·  Inputs Fully Compatible with MOST TTL Circuits.