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Part Name(s) : DG12864 DG-12864 ETC
Unspecified
Description : 128 X 64 dots 1/64 Duty STN Reflective/EL/LED Backlight View

128 X 64 dots 1/64 Duty STN Reflective/EL/LED Backlight

Part Name(s) : V826516B04S V826516B04SXTG-B1 V826516B04SXTG-A1 V826516B04SXTG-B0 Mosel-Vitelic
Mosel Vitelic Corporation
Description : 128 MB 200-Pin DDR UNBUFFERED SODIMM 2.5 VOLT 16M x 64 View

Description
The V826516B04S memory module is organized 16,777,216 x 64 bits in a 200 Pin memory module. The 16M x 64 memory module uses 8 Mosel-Vitelic 8M x 16 DDR SDRAM. The x64 modules are ideal for use in high performance computer systems where increased memory density and fast access times are required.
   
Features
■ JEDEC 200 Pin DDR Unbuffered Small-Outline,
    Dual In-Line memory module (SODIMM);
    16,777,216 x 64 bit organization.
■ Utilizes High Performance 8M x 16 DDR
    SDRAM in TSOPII-66 Packages
■ Single +2.5V (± 0.2V) Power Supply
■ Programmable CAS Latency, Burst Length, and
    Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are SSTL-2 Compatible
■ 4096 Refresh Cycles every 64 ms
■ Serial Presence Detect (SPD)
■ DDR SDRAM Performance
   

Part Name(s) : V826632G24S V826632G24SXTG-A1 V826632G24SXTG-B0 V826632G24SXTG-B1 V826632G24SXTG-C0 Mosel-Vitelic
Mosel Vitelic Corporation
Description : 256 MB 200-Pin DDR UNBUFFERED SODIMM 2.5 VOLT 32M x 64 View

Description
The V826632G24S memory module is organized 33,554,432 x 64 bits in a 200 Pin memory module. The 32M x 64 memory module uses 8 Mosel-Vitelic 32M x 8 DDR SDRAM. The x64 modules are ideal for use in high performance computer systems where increased memory density and fast access times are required.

Features
■ JEDEC 200 Pin DDR Unbuffered Small-Outline,
   Dual In-Line memory module (SODIMM);
   33,554,432 x 64 bit organization.
■ Utilizes High Performance 32M x 8 DDR
   SDRAM in TSOPII-66 Packages
■ Single +2.5V (± 0.2V) Power Supply
■ Programmable CAS Latency, Burst Length, and
   Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are SSTL-2 Compatible
■ 8192 Refresh Cycles every 64 ms
■ Serial Presence Detect (SPD)
■ DDR SDRAM Performance

Part Name(s) : V826632B24S V826632B24SXTG-A1 V826632B24SXTG-B0 V826632B24SXTG-B1 V826632B24SXTG-C0 Mosel-Vitelic
Mosel Vitelic Corporation
Description : 256 MB 200-Pin DDR UNBUFFERED SODIMM 2.5 VOLT 32M x 64 View

Description
The V826632B24S memory module is organized 33,554,432 x 64 bits in a 200 Pin memory module. The 32M x 64 memory module uses 8 Mosel-Vitelic 16M x 16 DDR SDRAM. The x64 modules are ideal for use in high performance computer systems where increased memory density and fast access times are required.

Features
■ JEDEC 200 Pin DDR Unbuffered Small-Outline,
   Dual In-Line memory module (SODIMM);
   33,554,432 x 64 bit organization.
■ Utilizes High Performance 16M x 16 DDR
   SDRAM in TSOPII-66 Packages
■ Single +2.5V (± 0.2V) Power Supply
■ Programmable CAS Latency, Burst Length, and
   Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are SSTL-2 Compatible
■ 8192 Refresh Cycles every 64 ms
■ Serial Presence Detect (SPD)
■ DDR SDRAM Performance


Part Name(s) : V436616R24V V436616R24VATG-10PC V436616R24VATG-75 V436616R24VATG-75PC V436616R24VBTG-10PC V436616R24VBTG-75 V436616R24VBTG-75PC V436616R24VXTG-XX MOSEL
Mosel Vitelic, Corp
Description : 128 MB 168-Pin UNBUFFERED DIMM 3.3 VOLT 16M x 64 View

Description
The V436616R24V memory module is organized 16, 777, 216 x 64 bits in a 168 Pin dual in line memory module (DIMM). The 16M x 64 memory module uses 4 Mosel-Vitelic 16M x 16 SDRAM. The x64 modules are ideal for use in high performance computer systems where increased memory density and fast access times are required.

Features
■ 168 Pin Unbuffered 16, 777, 216 x 64 bit Oganization SDRAM DIMM
■ Utilizes High Performance 256 Mbit, 16M x 16 SDRAM in TSOPII-54 Packages
■ Fully PC Board Layout Compatible to INTEL’S Rev 1.0 Module Specification
■ Single +3.3V (± 0.3V) Power Supply
■ Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
■ Auto Refresh (CBR) and Self Refresh
■ All Inputs, Outputs are LVTTL Compatible
■ 8192 Refresh Cycles every 64 ms
■ Serial Present Detect (SPD)
■ SDRAM Performance
■ Supported Latencies at 133 MHz Operation for Module

Part Name(s) : 83C748 87C748 P83C748EBAA P83C748EBDDB P83C748EBPN P87C748EBAA P87C748EBDDB P87C748EBPN Philips
Philips Electronics
Description : 80C51 8-bit microcontroller family 2K/64 OTP/ROM, low Pin count View

DESCRIPTION

The Philips 83C748/87C748 offers the advantages of the 80C51 architecture in a small package and at low cost. The 8XC748 Microcontroller is fabricated with Philips high-density CMOS technology. Philips epitaxial substrate minimizes CMOS latch-up sensitivity. The 8XC748 contains a 2k × 8 ROM (83C748) EPROM (87C748), a 64 × 8 RAM, 19 I/O lines, a 16-bit auto-reload counter/timer, a four-source, fixed-priority level interrupt structure, and an on-chip oscillator.



FEATURES

• 80C51 based architecture

• Small package sizes

– 24-Pin DIP (300 mil “skinny DIP”)

– 24-Pin Shrink Small Outline Package (SSOP)

– 28-Pin PLCC

• 87C748 available in erasable quartz lid or one-time programmable plastic packages

• Wide oscillator frequency range: –3.5 to 16MHz

• Low power consumption:

– Normal operation: less than 11mA @ 5V, 12MHz

– Idle mode

– Power-down mode

• 2k × 8 ROM (83C748)

2k × 8 EPROM (87C748)

64 × 8 RAM

• 16-bit auto reloadable counter/timer

• 10-bit fixed-rate timer

• Boolean processor

• CMOS and TTL compatible

• Well suited for logic replacement, consumer and industrial applications

• LED drive outputs


Part Name(s) : 5200 5200-SERIES Agere
Agere -> LSI Corporation
Description : 5200-Series 64 x 64 MEMS Optical Switch Module View

Description

The fully-integrated 5200-Series 64 x 64 MEMS-based optical switch component for optical networking systems features scalable, 3D MEMS architecture. It offers 64 input and 64 output ports in a small form factor, and contains the control and feedback electronics needed to be easily incorporated into a system.

The 64 x 64 MEMS optical switch module utilizes moving micromirrors capable of manipulating light, eliminating the need for OEO conversions, and resulting in bit-rate and protocol independence.



Features

■ MEMS 3D architecture

■ Small form factor

■ Low loss

■ Low power dissipation

■ Nonblocking

■ Scalable

■ Protocol and bandwidth independent

■ Data rate transparency

■ Integrated control electronics



Applications

■ Optical cross connects

■ Optical add/drop multiplexer

■ Dynamic capacity provisioning

■ Test equipment



 


Part Name(s) : 83C750 87C750 P83C750 P83C750EBAA P83C750EBDDB P83C750EBPN P83C750EFAA P83C750EFPN P87C750 P87C750EBAA Philips
Philips Electronics
Description : 80C51 8-bit microcontroller family 1K/64 OTP ROM, low Pin count View

DESCRIPTION

The Philips 8XC750 offers the advantages of the 80C51 architecture in a small package and at low cost. The 8XC750 Microcontroller is fabricated with Philips high-density CMOS technology. Philips epitaxial substrate minimizes CMOS latch-up sensitivity. The 87C750 contains a 1k ×8 EPROM, a 64×8 RAM, 19 I/O lines, a 16-bit auto-reload counter/timer, a five-source, fixed-priority level interrupt structure and an on-chip oscillator.





FEATURES

•80C51 based architecture

•Oscillator frequency range—up to 16MHz

•Small package sizes

–24-Pin DIP (300 mil “skinny DIP”)

–24-Pin Shrink Small Outline Package

–28-Pin PLCC

•87C750 available in one-time programmable plastic packages

•Low power consumption:

–Normal operation: less than 11mA @ 5V, 12MHz

–Idle mode

–Power-down mode

•1k ×8 EPROM (87C750)

64 ×8 RAM

•16-bit auto reloadable counter/timer

•Boolean processor

•CMOS and TTL compatible

•Well suited for logic replacement, consumer and industrial applications

•LED drive outputs


Part Name(s) : LPC47N217-JN SMSC
SMSC -> Microchip
Description : 64-Pin Super I/O with LPC Interface View

General Description

The SMSC LPC47N217 is a 3.3V PC 99, PC2001, and ACPI 2.0 compliant Super I/O Controller. The LPC47N217 implements the LPC interface, a Pin reduced ISA interface which provides the same or better performance as the ISA/X-bus with a substantial savings in Pins used. The part also includes 14 GPIO Pins.

The LPC47N217 incorporates a 16C550A compatible UART and one Multi-Mode parallel port with ChiProtect™ circuitry plus EPP and ECP support. This device also offers a full 16-bit internally decoded address bus, a Serial IRQ interface with PCI CLKRUN# support, relocatable configuration ports, and three DMA channel options.



Product Features

■ 3.3 Volt Operation (5V tolerant)

■ Programmable Wakeup Event Interface (IO_PME# Pin)

■ SMI Support (IO_SMI# Pin)

■ GPIOs (14)

■ Two IRQ Input Pins

■ XNOR Chain

■ PC99a, PC2001

■ ACPI 2.0 Compliant

64-Pin STQFP Lead-free RoHS Compliant Package

■ Intelligent Auto Power Management

■ Serial Ports

   − One Full Function Serial Port

   − High Speed 16C550A Compatible UART with Send/Receive 16-Byte FIFO

   − Supports 230k and 460k Baud

   − Programmable Baud Rate Generator

   − Modem Control Circuitry

■ Infrared Communications Controller

   − IrDA v1.2 (4Mbps), HPSIR, ASKIR, Consumer IR Support

   − 1 IR Port

   − 96 Base I/O Address, 15 IRQ Options and 3 DMA Options

■ Multi-Mode Parallel Port with ChiProtect

   − Standard Mode IBM PC/XT, PC/AT, and PS/2 Compatible Bidirectional Parallel Port

   − Enhanced Parallel Port (EPP) Compatible - EPP 1.7 and EPP 1.9 (IEEE 1284 Compliant)

   − IEEE 1284 Compliant Enhanced Capabilities Port(ECP)

   − ChiProtect Circuitry for Protection Against Damage Due to Printer Power-On

   − 192 Base I/O Address, 15 IRQ and 3 DMA Options

■ LPC Bus Host Interface

   − Multiplexed Command, Address and Data Bus

   − 8-Bit I/O Transfers

   − 8-Bit DMA Transfers

   − 16-Bit Address Qualification

   − Serial IRQ Interface Compatible with Serialized IRQ Support for PCI Systems

   − PCI CLKRUN# Support

   − Power Management Event (IO_PME#) Interface Pin



 


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