High-speed matched-impedance parallel board-to-board connector designed for applications requiring board-to board spacing with transmission speeds exceeding 1GHz. The connection system has matched impedance of 50 ohm or can be customized. Contacts are on 0.5mm pitch.
1. Impedance Matching using a 4-Layer Board
The innovative transmission module uses PC boards with a strip line design of transmission lines, providing matched impedance of 50 ohms, for standard PRODUCT.
2. Supports Multiple Connectors per board
Designed with a tolerance of +/- 0.2mm for both the X and Y-axis. The three-piece structure and the +/- 0.2mm tolerance allows 3 or more IT1’s to be mounted on a single board.
3. Customized Board-to-Board Distance
Board-to-board distance can be customized, from 16mm to 40mm.
Ground lines or additional traces can be added to support high level, high speed transmission or mixed power/signal applications.
4. Signal to Ground Ratio
The standard signal-to-ground ratio is 10:2, which makes reliable matching of the characteristic impedance of each transmission line. This ratio also can be customized.
5. Contact Reliability
Use of double contact points on each of the contacts assures highly reliable performance.
Routers, servers, base stations and other telecommunication equipment.
SV Microwave is a world leader in the RF/Microwave industry with over 40 years of proven performance. We design and manufacture RF/Microwave coaxial connectors, cable assemblies and passive components for military, satellite, aerospace, commercial and telecommunications applications.
We specialize in customized application specifc solutions, but also oﬀer a wide range of Commercial Oﬀ The Shelf (COTS) PRODUCTs shown in this CATALOG. When it comes to the design and manufacture of precision PRODUCTs, SV Microwave has set the standard.
SV Microwave is committed to helping our customers meet their RF/Microwave performance goals with our highly talented engineering team, outstanding customer service and precision manufacturing capabilities.)
The board to board stacking height can correspond to 3mm~16mm.
2. SMT Coplanarity
The coplanarity of the SMT solder area lead is maintained at the high accuracy of less than 0.1mm.
3. Mating Guide
The very small and guide rib is provided, and secures ±0.6mm self-alignment, considering the mating operativity into accounts.
4. Mis-insertion Prevention
The boss prevents mis-insertion in the board to cause due to the boss position and boss diameter.
5. Two-piece Connection PRODUCT
In order to enhance the mating reliability for the fine pitch connector using two-pieces, the two-pieces of connectors are combined by our unique method, and can secure the mount
position accuracy. In such a new concept, the two-piece connected PRODUCT is prepared at every number of contacts (The standard mating pitch for the two-piece interconnected PRODUCT in two rows is 11mm.)
Note pc, business equipments, which require miniaturization or light-weight
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