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Description : 3.3V/5V, Single-Channel 1.5A Current-Limited Power Distribution Switch with Output Discharge

DESCRIPTION
The MP62170-1/MP62171-1 Power Distribution Switch features internal current limiting to prevent damage to host devices due to faulty load conditions. The MP62170-1/MP62171-1 analog switch has 75mΩ on-resistance and operates from 2.7V to 5.5V input. It is available with guaranteed current limits, making it ideal for load switching applications. The MP62170- 1/MP62171-1 has built-in protection for both over current and increased thermal stress. For over current, the device will limit the current by changing to a constant current mode.

FEATURES
• 1.5A Continuous Current
• Accurate Current Limit
• Output Discharge Function
• 2.7V to 5.5V Supply Range
• 90uA Quiescent Current
• 75mΩ MOSFET
• Thermal-Shutdown Protection
• Under-Voltage Lockout
• 8ms FLAG Deglitch Time
• No FLAG Glitch During Power Up
• Reverse Current Blocking
• Active High & Active Low Options
• SOIC8 & MSOP8 Packages

APPLICATIONS
• Smartphone and PDA
• Portable GPS Device
• Notebook PC
• Set-top-box
• Telecom and Network Systems
• PC Card Hot Swap
• USB Power Distribution

Realtek
Realtek Semiconductor
Description : SINGLE-CHIP OCTAL 10/100BASE-TX/FX PHY TRANSCEIVER

1. General Description

The RTL8208B-LF and RTL8208BF-LF (jointly referred to as the RTL8208B(F)-LF) are single-chip highly integrated 8-port, 10Base-T/100Base-TX (FX) Ethernet transceivers implemented in 0.18µm CMOS technology. They are currently the world’s smallest Octal-PHY chip Package. Realtek patented removal of traditional SD pins in 100Base-FX (RTL8208BF-LF only) allow us to obtain a lower pin count. Flexible hardware settings are provided to configure the various operating modes of the chip.



2. Features

  Supports 8-port integrated physical layer and transceiver for 10Base-T and 100Base-TX

  Up to 8 ports support 100Base-FX (RTL8208BF-LF only)

  Reduced 100Base-FX (RTL8208BF-LF only) interface (patented)

  Robust baseline wander correction for improved 100Base-TX performance

  Complies with IEEE 802.3/802.3u

  IEEE 802.3u compliant auto negotiation for 10/100Mbps control

  Hardware controlled Flow control advertisement ability

  Supports RMII/SMII/SS-SMII interfaces

  Very low power consumption

  Supports Port-Pair Loopback mode (PPLPBK mode, RTL8208BF-LF only)

  Supports two power reduction methods:

  Power saving mode (cable detection)

  Power down mode

  Power-on auto reset function eliminates the need for external reset circuits

  Crossover detection and auto correction

  Polarity detection and Auto Correction

  Flexible serial/scan LED display modes

  Cable tester for diagnosing open/short faults in attached cables

  128-pin QFP Package

  1.8V/3.3V power supply

  0.18µm, CMOS technology



3. Applications

  RTL8208B-LF

    Octal PHY for Fast Ethernet switch with twisted pair interface

  RTL8208BF-LF

    Octal PHY for Fast Ethernet switch with twisted pair interface and fiber capability



 


Part Name(s) : PT6601 PT6601-H
Princeton
Princeton Technology
Description : LCD driver IC / PT6601 100 Pins, QFP Package

PT6601 is a Segment Driver LCD Driver IC utilizing CMOS Technology used for Large Scale Dot Matrix Liquid Crystal Graphic Displays. 80 bits of display data sent from a controller are latched using a 4-bit parallel transfer technique and LCD drive signals are generated. It can be used with Common LCD Driver, PT6630 to drive Large Screen LCD Panels.



FEATURES

• CMOS Technology

• Supports Display Duties from 1/64 to 1/256

• Operating Supply Voltage:

               VDD (Logic Block): 5V + 10%

               VDD -VEE (LCD Block): 12 to 32 V

• Operating Temperature: -20 to +75°C

• Supports Power Reduction in Large Scale Panel via a Chip Disable Pin

• LCD Drive Circuit for 80 bits Display

• 4 -Bit Parallel Data Input

• Maximum of 6.0 MHz Data Transfer Clock and Bidirectional Shifting Supported

• Available in C.O.B. or 100-pin, QFP Package


Description : 10, 15, 25, 35A FAST RECOVERY SINGLE-PHASE BRIDGE RECTIFIER

Features

● Diffused Junction

● Low Reverse Leakage Current

● Low Power Loss, High Efficiency

● Electrically Isolated Epoxy Case for Maximum Heat Dissipation

● Case to Terminal Isolation Voltage 2500V

● Recognized File # E157705

 



 


Description : HIGHSENSITIVITY IR LIGHTTOVOLTAGE CONVERTER

Description
The TSL260R, TSL261R, and TSL262R are infrared light-to-voltage optical sensors, each combining a photodiode and a transimpedance amplifier (feedback resistor = 16 MΩ, 8 MΩ, and 2.8 MΩ respectively) on a single monolithic IC. Output voltage is directly proportional to the light intensity (irradiance) on the photodiode. These devices have improved amplifier offset-voltage stability and low power consumption and are supplied in a 3-lead plastic sidelooker Package with an integral visible light cutoff filter and lens. When supplied in the lead (Pb) free Package, the device is RoHS compliant.

● Integral Visible Light Cutoff Filter
● Monolithic Silicon IC Containing Photodiode, Operational Amplifier, and Feedback Components
● Converts Light Intensity to a Voltage
● High Irradiance Responsivity, Typically 111 mV/(μW/cm2) at λp = 940 nm (TSL260R)
● Compact 3-Lead Plastic Package
● Single Voltage Supply Operation
● Low Dark (Offset) Voltage....10mV Max
● Low Supply Current......1.1 mA Typical
● Wide Supply-Voltage Range.... 2.7 V to 5.5 V
● Replacements for TSL260, TSL261, and TSL262
● RoHS Compliant (−LF Package Only)

Description : LIGHT-TO-VOLTAGE OPTICAL SENSORS

Description
The TSL250R, TSL251R, and TSL252R are light-to-voltage optical sensors, each combining a photodiode and a transimpedance amplifier (feedback resistor = 16 MΩ, 8 MΩ, and 2.8 MΩ respectively) on a single monolithic IC. Output voltage is directly proportional to the light intensity (irradiance) on the photodiode. These devices have improved amplifier offset-voltage stability and low power consumption and are supplied in a 3-lead clear plastic sidelooker Package with an integral lens. When supplied in the lead (Pb) free Package, the device is RoHS compliant.

● Monolithic Silicon IC Containing Photodiode, Operational Amplifier, and Feedback Components
● Converts Light Intensity to a Voltage
● High Irradiance Responsivity, Typically 137 mV/(μW/cm2) at λp = 635 nm (TSL250R)
● Compact 3-Lead Clear Plastic Package
● Single Voltage Supply Operation
● Low Dark (Offset) Voltage....10 mV Max
● Low Supply Current......1.1 mA Typical
● Wide Supply-Voltage Range.... 2.7 V to 5.5 V
● Replacements for TSL250, TSL251, and TSL252
● RoHS Compliant (−LF Package Only)

Description : INFRARED LIGHT-TO-VOLTAGE OPTICAL SENSORS

Description
The TSL260R, TSL261R, and TSL262R are infrared light-to-voltage optical sensors, each combining a photodiode and a transimpedance amplifier (feedback resistor = 16 MΩ, 8 MΩ, and 2.8 MΩ respectively) on a single monolithic IC. Output voltage is directly proportional to the light intensity (irradiance) on the photodiode. These devices have improved amplifier offset-voltage stability and low power consumption and are supplied in a 3-lead plastic sidelooker Package with an integral visible light cutoff filter and lens. When supplied in the lead (Pb) free Package, the device is RoHS compliant.

● Integral Visible Light Cutoff Filter
● Monolithic Silicon IC Containing Photodiode, Operational Amplifier, and Feedback Components
● Converts Light Intensity to a Voltage
● High Irradiance Responsivity, Typically 111 mV/(μW/cm2) at λp = 940 nm (TSL260R)
● Compact 3-Lead Plastic Package
● Single Voltage Supply Operation
● Low Dark (Offset) Voltage....10mV Max
● Low Supply Current......1.1 mA Typical
● Wide Supply-Voltage Range.... 2.7 V to 5.5 V
● Replacements for TSL260, TSL261, and TSL262
● RoHS Compliant (−LF Package Only)

Part Name(s) : QFP-SD
STATSCHIP
STATS ChipPAC, Ltd.
Description : Stacked Die Quad Flat Pack

DESCRIPTION
STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die low profile QFP. LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance. TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance. STATS ChipPAC’s chip stacking technology allows the integration of multiple ICs within a single Package to improve Package performance and functionality while reducing overall Package size and cost.

FEATURES
• Combining devices into one Package reduces PCB real estate and cost
• Increased sub-system performance by integrating multiple chips into a single Package
• Die to die bonding capability for device/signal integration
• Standard and green/lead-free materials and Pb-free plating
• Options for mixed technologies, 2 or more stacked dice
• Fine pitch bonding capability
• Exposed pad provides enhanced thermal performance
• Low profile Package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD)
• Lead pitch ranges from 0.80mm to 0.40mm
• Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to 216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD)
• JEDEC standard compliant Package outlines

Description : Mobile video DENC

Description
STw80x9 is aimed at mobile video Digital ENCoder (DENC). This device converts digital video signals into high quality analog signal compliant with TV standards, it is able to encode interlaced (in all standards) and non-interlaced (in PAL and NTSC).

Features
■ Two analog outputs (10 bits DAC) with:
    – CVBS (Composite) output or Y/C (S-VHS)
    – NTSC-J, M & 4.43 & PAL-BDGHI, N, Nc, M support
    – 35 mA current driver
■ 8-bit digital interface input supporting both embedded and external synchro
    – CCIR 601 / YCbCr 4:2:2 format
    – CCIR 656: 27 Mhz pixel input clock
■ Latest Macrovision (7.1.L1) (STw8019 only)
■ 2-wire serial MPU interface (I2C compatible)
■ Master and slave modes
■ TV / VCR plug insertion detection
■ Supply voltages
    – 2.8V/3.3V analog
    – 1.8V/2.8Vdigital I/O
    – 1.2V/1.4V for core
■ Power consumption
    – Sleep mode: 5 µW
    – Standby mode: 150 µW maximum
    – CVBS: 125 mW
    – Y/C: 245 mW
Package
    – TFBGA 4x4x1.2 mm height, 0.5 mm pitch,
    – VFBGA 3x3x1 mm height, 0.4 mm pitch
■ Full matrix: 7 x 7

Applications
■ Mobile video Digital ENCoder (DENC)

Description : REAL-TIME EMULATOR FOR THE ST6 MCU FAMILY

GENERAL DESCRIPTION
The ST6 Real Time Development System is an advanced hardware development system designed and configured to provide comprehensive support for the ST6 family of MCUs.

Hardware Features
■ Real time emulation
■ 32 Kbytes of emulation memory
■ Breakpoint on a single address or on an address range
■ Break events can be defined in Program Space or Data space
   combined with up to 4 external signals
■ 2 fully programmable signal outputs for hardware triggering or timing measurements
■ Register read/write on-the-fly (without wait states)
■ Selective trace in Address Range or Start/Stop mode
■ Break on stack overflow
■ 1 Kbytes of real trace memory
■ Tracing of up to 32 bits including 4 external signals

Software Features
Raisonance IDE and C Compiler (optionally available)
■ IDE Interface (Ride) for Windows 95, Windows 98 and Windows NT
■ C or assembler source-level debugging

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