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70T03GH

  

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70T03GH [N-CHANNEL ENHANCEMENT MODE POWER MOSFET ]

other parts : 70T03J-HF  70TO3GH  70TO3J-HF  AP70T03GH  AP70T03GH/J-HF  AP70T03GH-HF  AP70T03GJ  AP70T03GJ-HF  AP70T03J-HF  AP70TO3GJ-HF 

APEC
Advanced Power Electronics Corp

Description
Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-252 package is widely preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. The through-hole version (AP70T03GJ) are available for low-profile applications.

▼ Simple Drive Requirement
▼ Low Gate Charge
▼ Fast Switching
▼ RoHS Compliant

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70T03GH [N-channel Enhancement-mode Power MOSFET ]

other parts : 70T03J  SSM70T03GH  SSM70T03GJ  70T03GJ 

ETC
Unspecified

[Silicon Standard]

DESCRIPTION
The SSM70T03 acheives fast switching performance with low gate charge without a complex drive circuit. It is suitable for low voltage applications such as DC/DC converters and general load-switching circuits.

The SSM70T03GH is in a TO-252 package, which is widely used for commercial and industrial surface-mount applications.
The through-hole version, the SSM70T03GJ in TO-251, is available for vertical mounting, where a small footprint is required on the board, and/or an external heatsink is to be attached.

These devices are manufactured with an advanced process, providing improved on-resistance and switching performance. The devices have a maximum junction temperature rating of 175°C for improved thermal margin and reliability.

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70T03GH [N-channel Enhancement-mode Power MOSFET ]

other parts : 70T03GJ  70T03J  SSM70T03GH  SSM70T03GJ 

SSC
Silicon Standard Corp.

DESCRIPTION
The SSM70T03 acheives fast switching performance with low gate charge without a complex drive circuit. It is suitable for low voltage applications such as DC/DC converters and general load-switching circuits.

The SSM70T03GH is in a TO-252 package, which is widely used for commercial and industrial surface-mount applications.
The through-hole version, the SSM70T03GJ in TO-251, is available for vertical mounting, where a small footprint is required on the board, and/or an external heatsink is to be attached.

These devices are manufactured with an advanced process, providing improved on-resistance and switching performance. The devices have a maximum junction temperature rating of 175°C for improved thermal margin and reliability.

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