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74AC11245PW

  

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一致 , 類似 74AC11245PW
前一致 74AC11245PWL*
後一致 N/A
含む N/A
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74AC11245PW [OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS ]

other parts : AC11245  74AC11245  74AC11245NT  74AC11245DW  74AC11245DB  74AC11245DBR  74AC11245DWR  74AC11245DBLE  74AC11245DWG4  74AC11245NTE4 

TI
Texas Instruments

description
This octal bus transceiver is designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.
The device allows noninverted data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated.
The 74AC11245 is characterized for operation from –40°C to 85°C.

• 3-State Outputs Drive Bus Lines Directly
• Flow-Through Architecture Optimizes PCB Layout
• Center-Pin VCC and GND Configurations
   Minimize High-Speed Switching Noise
• EPIC™ (Enhanced-Performance Implanted CMOS) 1-μm Process
• 500-mA Typical Latch-Up Immunity at 125°C
• Package Options Include Plastic
   Small-Outline (DW), Shrink Small-Outline (DB), and
   Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (NT)

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74AC11245PWLE [OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS ]

other parts : AC11245  74AC11245  74AC11245PW  74AC11245NT  74AC11245DW  74AC11245DB  74AC11245DBR  74AC11245DWR  74AC11245DWG4  74AC11245NTE4 

TI
Texas Instruments

description
This octal bus transceiver is designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.
The device allows noninverted data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated.
The 74AC11245 is characterized for operation from –40°C to 85°C.

• 3-State Outputs Drive Bus Lines Directly
• Flow-Through Architecture Optimizes PCB Layout
• Center-Pin VCC and GND Configurations
   Minimize High-Speed Switching Noise
• EPIC™ (Enhanced-Performance Implanted CMOS) 1-μm Process
• 500-mA Typical Latch-Up Immunity at 125°C
• Package Options Include Plastic
   Small-Outline (DW), Shrink Small-Outline (DB), and
   Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (NT)

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