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74AC16652DLR

  

データシート

一致 , 類似 74AC16652DLR
前一致 74AC16652DLR* 74AC16652DLRG*
後一致 N/A
含む N/A

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74AC16652DLR [16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS ]

other parts : 54AC16652  54AC16652WD  74AC16652  74AC16652DL  74AC16652DLG4  74AC16652DLRG4 

TI
Texas Instruments

description
The ’AC16652 are 16-bit bus transceivers that consist of D-type flip-flops and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. They can be used as two 8-bit transceivers or one 16-bit transceiver.

• Members of the Texas Instruments Widebu™ Family
• Independent Registers and Enables for A and B Buses
• Multiplexed Real-Time and Stored Data
• Flow-Through Architecture Optimizes PCB Layout
• Distributed VCC and GND Pin Configurations Minimize High-Speed Switching Noise
• EPIC  (Enhanced-Performance Implanted CMOS) 1-µm Process
• 500-mA Typical Latch-Up Immunity at 125°C
• Package Options Include Plastic 300-mil
   Shrink Small-Outline (DL) Packages Using
   25-mil Center-to-Center Pin Spacings and
   380-mil Fine-Pitch Ceramic Flat (WD)
   Packages Using 25-mil Center-to-Center
   Pin Spacings

 

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74AC16652DLRG4 [16-BIT BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS ]

other parts : 54AC16652  54AC16652WD  74AC16652  74AC16652DL  74AC16652DLG4  74AC16652DLR 

TI
Texas Instruments

description
The ’AC16652 are 16-bit bus transceivers that consist of D-type flip-flops and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. They can be used as two 8-bit transceivers or one 16-bit transceiver.

• Members of the Texas Instruments Widebu™ Family
• Independent Registers and Enables for A and B Buses
• Multiplexed Real-Time and Stored Data
• Flow-Through Architecture Optimizes PCB Layout
• Distributed VCC and GND Pin Configurations Minimize High-Speed Switching Noise
• EPIC  (Enhanced-Performance Implanted CMOS) 1-µm Process
• 500-mA Typical Latch-Up Immunity at 125°C
• Package Options Include Plastic 300-mil
   Shrink Small-Outline (DL) Packages Using
   25-mil Center-to-Center Pin Spacings and
   380-mil Fine-Pitch Ceramic Flat (WD)
   Packages Using 25-mil Center-to-Center
   Pin Spacings

 

View
1

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