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74ACT11244DW

  

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74ACT11244DW [OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS ]

other parts : 74ACT11244  74ACT11244DB  74ACT11244DBLE  74ACT11244DBR  74ACT11244DWG4  74ACT11244DWR  74ACT11244NSR 

TI
Texas Instruments

description
ThIs octal buffer or line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the ’ACT11240, this device provides the choice of various combinations of inverting and noninverting outputs. The 74ACT11244 is characterized for operation from –40°C to 85°C.

3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
Inputs Are TTL-Voltage Compatible
Flow-Through Architecture Optimizes PCB Layout
Center-Pin VCCand GND Configurations to Minimize High-Speed Switching Noise
EPIC™ (Enhanced-Performance Implanted CMOS) 1-m Process
500-mA Typical Latch-Up Immunity at 125°C
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (NT)

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74ACT11244DWR [OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS ]

other parts : 74ACT11244  74ACT11244DB  74ACT11244DBLE  74ACT11244DBR  74ACT11244DW  74ACT11244DWG4  74ACT11244NSR 

TI
Texas Instruments

description
ThIs octal buffer or line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the ’ACT11240, this device provides the choice of various combinations of inverting and noninverting outputs. The 74ACT11244 is characterized for operation from –40°C to 85°C.

3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
Inputs Are TTL-Voltage Compatible
Flow-Through Architecture Optimizes PCB Layout
Center-Pin VCCand GND Configurations to Minimize High-Speed Switching Noise
EPIC™ (Enhanced-Performance Implanted CMOS) 1-m Process
500-mA Typical Latch-Up Immunity at 125°C
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (NT)

View
74ACT11244DWG4 [OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS ]

other parts : 74ACT11244  74ACT11244DB  74ACT11244DBLE  74ACT11244DBR  74ACT11244DW  74ACT11244DWR  74ACT11244NSR 

TI
Texas Instruments

description
ThIs octal buffer or line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the ’ACT11240, this device provides the choice of various combinations of inverting and noninverting outputs. The 74ACT11244 is characterized for operation from –40°C to 85°C.

3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
Inputs Are TTL-Voltage Compatible
Flow-Through Architecture Optimizes PCB Layout
Center-Pin VCCand GND Configurations to Minimize High-Speed Switching Noise
EPIC™ (Enhanced-Performance Implanted CMOS) 1-m Process
500-mA Typical Latch-Up Immunity at 125°C
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (NT)

View
74ACT11244DWE4 [OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS ] TI
Texas Instruments

description
ThIs octal buffer or line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the ’ACT11240, this device provides the choice of various combinations of inverting and noninverting outputs. The 74ACT11244 is characterized for operation from –40°C to 85°C.

3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
Inputs Are TTL-Voltage Compatible
Flow-Through Architecture Optimizes PCB Layout
Center-Pin VCCand GND Configurations to Minimize High-Speed Switching Noise
EPIC™ (Enhanced-Performance Implanted CMOS) 1-m Process
500-mA Typical Latch-Up Immunity at 125°C
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (NT)

View
74ACT11244DWRE4 [OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS ] TI
Texas Instruments

description
ThIs octal buffer or line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the ’ACT11240, this device provides the choice of various combinations of inverting and noninverting outputs. The 74ACT11244 is characterized for operation from –40°C to 85°C.

3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
Inputs Are TTL-Voltage Compatible
Flow-Through Architecture Optimizes PCB Layout
Center-Pin VCCand GND Configurations to Minimize High-Speed Switching Noise
EPIC™ (Enhanced-Performance Implanted CMOS) 1-m Process
500-mA Typical Latch-Up Immunity at 125°C
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (NT)

View
74ACT11244DWRG4 [OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS ] TI
Texas Instruments

description
ThIs octal buffer or line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the ’ACT11240, this device provides the choice of various combinations of inverting and noninverting outputs. The 74ACT11244 is characterized for operation from –40°C to 85°C.

3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
Inputs Are TTL-Voltage Compatible
Flow-Through Architecture Optimizes PCB Layout
Center-Pin VCCand GND Configurations to Minimize High-Speed Switching Noise
EPIC™ (Enhanced-Performance Implanted CMOS) 1-m Process
500-mA Typical Latch-Up Immunity at 125°C
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (NT)

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