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BYW29-50

  

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BYW29-50_2007 [Ultrafast Rectifier ]

other parts : BYW29-100_2007  BYWF29-50_2007  BYWB29-50_2007  BYW29-200_2007  BYW29-150_2007  BYWF29-100_2007  BYWF29-150_2007  BYWB29-150_2007  BYWB29-200_2007  BYWF29-200_2007 

Vishay
Vishay Semiconductors

FEATURES
• Glass passivated chip junction
• Ultrafast recovery time
• Low switching losses, high efficiency
• Low forward voltage drop
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
   peak of 245 °C (for TO-263AB package)
• Solder dip 260 °C, 40 s (for TO-220AC and
   ITO-220AC package)
• Component in accordance to RoHS 2002/95/EC
   and WEEE 2002/96/EC

TYPICAL APPLICATIONS
   For use in high frequency rectifier of switching mode
   power supplies, inverters, freewheeling diodes,
   dc-to-dc converters, and other power switching
   application.

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BYW29-50 [Ultrafast Rectifier ]

other parts : BYW29-100  BYWB29-50  BYW29-150  BYW29-200  BYW29-XXX  BYWF29-50  BYWB29-150  BYWF29-100  BYWB29-XXX  BYWB29-200 

Vishay
Vishay Semiconductors

FEATURES
• Power pack
• Glass passivated pellet chip junction
• Ultrafast recovery time
• Low switching losses, high efficiency
• Low forward voltage drop
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of
   245 °C (for TO-263AB package)
• Solder dip 275 °C max. 10 s, per JESD 22-B106
   (for TO-220AC and ITO-220AC package)
• AEC-Q101 qualified
   (for ITO-220AC and TO-263AB package)
• Material categorization: for definitions of compliance
   please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS
   For use in high frequency rectifier of switching mode
   power supplies, inverters, freewheeling diodes, DC/DC
   converters, and other power switching application.

View
BYW29-50-E3/45_2007 [Ultrafast Rectifier ]

other parts : BYW29-50_2007  BYW29-100_2007  BYWF29-50_2007  BYW29-200_2007  BYW29-150_2007  BYWB29-50_2007  BYWF29-100_2007  BYWF29-150_2007  BYWB29-150_2007  BYWB29-200_2007 

Vishay
Vishay Semiconductors

FEATURES
• Glass passivated chip junction
• Ultrafast recovery time
• Low switching losses, high efficiency
• Low forward voltage drop
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
   peak of 245 °C (for TO-263AB package)
• Solder dip 260 °C, 40 s (for TO-220AC and
   ITO-220AC package)
• Component in accordance to RoHS 2002/95/EC
   and WEEE 2002/96/EC

TYPICAL APPLICATIONS
   For use in high frequency rectifier of switching mode
   power supplies, inverters, freewheeling diodes,
   dc-to-dc converters, and other power switching
   application.

View
BYW29-50-E3/45 [Ultrafast Rectifier ]

other parts : BYW29-50  BYW29-100  BYW29-XXX  BYWF29-50  BYW29-200  BYW29-150  BYWB29-50  BYWB29-XXX  BYWB29-150  BYWB29-200 

Vishay
Vishay Semiconductors

FEATURES
• Power pack
• Glass passivated pellet chip junction
• Ultrafast recovery time
• Low switching losses, high efficiency
• Low forward voltage drop
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of
   245 °C (for TO-263AB package)
• Solder dip 275 °C max. 10 s, per JESD 22-B106
   (for TO-220AC and ITO-220AC package)
• AEC-Q101 qualified
   (for ITO-220AC and TO-263AB package)
• Material categorization: for definitions of compliance
   please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS
   For use in high frequency rectifier of switching mode
   power supplies, inverters, freewheeling diodes, DC/DC
   converters, and other power switching application.

View
BYW29-50HE3/45_2007 [Ultrafast Rectifier ]

other parts : BYW29-50_2007  BYW29-100_2007  BYWB29-50_2007  BYW29-150_2007  BYW29-200_2007  BYWF29-50_2007  BYWB29-150_2007  BYWF29-150_2007  BYWF29-100_2007  BYWB29-200_2007 

Vishay
Vishay Semiconductors

FEATURES
• Glass passivated chip junction
• Ultrafast recovery time
• Low switching losses, high efficiency
• Low forward voltage drop
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
   peak of 245 °C (for TO-263AB package)
• Solder dip 260 °C, 40 s (for TO-220AC and
   ITO-220AC package)
• Component in accordance to RoHS 2002/95/EC
   and WEEE 2002/96/EC

TYPICAL APPLICATIONS
   For use in high frequency rectifier of switching mode
   power supplies, inverters, freewheeling diodes,
   dc-to-dc converters, and other power switching
   application.

View
BYW29-50 [RECTIFIERS High Efficiency, 7A and 8A ]

other parts : BYW29  BYW80  UES1401  UES1402  UES1404  UES1403  BYW80-50  BYW29-150  BYW80-150  BYW80-200 

Microsemi
Microsemi Corporation

description
The UES1400/BYW29/BYW80 Series, in a plastic package similar to the TO-220, is sepecifically designed for operation in power switching circuit to frequencies in excess of 100KHz. The very low forward voltage and very fast recovery time make them particularly suited for switching type power supplies.

Features
● Very Low Forward Voltage
● Very Fast Recovery Times
● Economical, Convenient Plastic Package
● Low Thermal Resistance
● Mechanically Rugged

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BYW29-50 [FAST EFFICIENT PLASTIC RECTIFIER ]

other parts : BYW29-100  BYW29-150  BYW29-200 

GE
General Semiconductor

Reverse Voltage - 50 to 200 Volts Forward Current - 8.0 Amperes

FEATURES
♦ Plastic package has Underwriters Laboratory
   Flammability Classification 94V-0
♦ Glass passivated chip junction
♦ Low power loss
♦ Low leakage current
♦ High surge current capability
♦ Superfast recovery time for high efficiency
♦ High temperature soldering guaranteed:
   250°C, 0.16” (4.06mm) from case for 10 seconds

View
BYW29-50 [FAST EFFICIENT PLASTIC RECTIFIER ]

other parts : BYW29-100  BYW29-150  BYW29-200 

General
General Semiconductor

Reverse Voltage - 50 to 200 Volts Forward Current - 8.0 Amperes

FEATURES
♦ Plastic package has Underwriters Laboratory
   Flammability Classification 94V-0
♦ Glass passivated chip junction
♦ Low power loss
♦ Low leakage current
♦ High surge current capability
♦ Superfast recovery time for high efficiency
♦ High temperature soldering guaranteed:
   250°C, 0.16” (4.06mm) from case for 10 seconds

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