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IL215A

  

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IL215A [PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER ]

other parts : IL215  IL216A  IL217A 

Siemens
Siemens AG

DESCRIPTION
The IL215A/216A/217A are optically coupled pairs with a Gallium Arsenide infrared LED and a silicon NPN phototransistor. Signal information, including a DC level, can be transmitted by the device while maintaining a high degree of electrical isolation between input and output. The IL215A//216A/217A comes in a standard SOIC-8 small outline package for surface mounting which makes it ideally suited for high density applications with limited space. In addition to eliminating through-holes requirements, this package conforms to standards for surface mounted devices.

• FEATURES
• High Current Transfer Ratio, IF=1 mA
   IL215A—20% Minimum
   IL216A—50% Minimum
   IL217A—100% Minimum
• Isolation Voltage, 2500 VACRMS
• Electrical Specifications Similar to
   Standard 6 Pin Coupler
• Industry Standard SOIC-8 Surface
   Mountable Package
• Standard Lead Spacing, .05"
• Available in Tape and Reel Option
   (Conforms to EIA Standard RS481A)
• Compatible with Dual Wave, Vapor Phase
   and IR Reflow Soldering
• Underwriters Lab File #E52744
   (Code Letter P)

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IL215A [PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER ]

other parts : IL216A  IL217A 

Infineon
Infineon Technologies

DESCRIPTION
The IL215A/216A/217A are optically coupled pairs with a Gallium Arsenide infrared LED and a silicon NPN phototransistor. Signal information, including a DC level, can be transmitted by the device while maintaining a high degree of electrical isolation between input and output. The IL215A//216A/217A comes in a standard SOIC-8 small outline package for surface mounting which makes it ideally suited for high density applications with limited space. In addition to eliminating through-holes requirements, this package conforms to standards for surface mounted devices.

• FEATURES
• High Current Transfer Ratio, IF=1 mA
   IL215A—20% Minimum
   IL216A—50% Minimum
   IL217A—100% Minimum
• Isolation Voltage, 2500 VACRMS
• Electrical Specifications Similar to
   Standard 6 Pin Coupler
• Industry Standard SOIC-8 Surface
   Mountable Package
• Standard Lead Spacing, .05"
• Available in Tape and Reel Option
   (Conforms to EIA Standard RS481A)
• Compatible with Dual Wave, Vapor Phase
   and IR Reflow Soldering
• Underwriters Lab File #E52744
   (Code Letter P)

View
IL215AT [PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER ]

other parts : IL216AT  IL217AT 

Infineon
Infineon Technologies

DESCRIPTION
The IL215AT/216AT/217AT is an optically coupled pair with a Gallium Arsenide infrared LED and a silicon NPN phototransistor. Signal information, including a DC level, can be transmitted by the device while maintaining a high degree of electrica isolation between input and output. The IL215AT/ 216AT/217AT comes in a standard SOIC-8 small outline package for surface mounting which makes it ideally suited for high density applications with limited space. In addition to eliminating through holes requirements, this package conforms to standards for surface mounted devices.

FEATURES
• High Current Transfer Ratio, IF=1 mA
   IL215AT, 20% Minimum
   IL216AT, 50% Minimum
   IL217AT, 100% Minimum
• Isolation Voltage, 2500 VACRMS
• Electrical Specifications Similar to
   Standard 6 Pin Coupler
• Industry Standard SOIC-8 Surface
   Mountable Package
• Standard Lead Spacing, .05"
• Available in Tape and Reel (suffix T)
   (Conforms to EIA Standard RS481A)
• Compatible with Dual Wave, Vapor Phase
   and IR Reflow Soldering
• Underwriters Lab File #E52744
   (Code Letter P)

View
IL215AT [PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER ]

other parts : IL216AT  IL217AT 

Siemens
Siemens AG

DESCRIPTION
The IL215AT/216AT/217AT is an optically coupled pair with a Gallium Arsenide infrared LED and a silicon NPN phototransistor. Signal information, including a DC level, can be transmitted by the device while maintaining a high degree of electrica isolation between input and output. The IL215AT/ 216AT/217AT comes in a standard SOIC-8 small outline package for surface mounting which makes it ideally suited for high density applications with limited space. In addition to eliminating through holes requirements, this package conforms to standards for surface mounted devices.

FEATURES
• High Current Transfer Ratio, IF=1 mA
   IL215AT, 20% Minimum
   IL216AT, 50% Minimum
   IL217AT, 100% Minimum
• Isolation Voltage, 2500 VACRMS
• Electrical Specifications Similar to
   Standard 6 Pin Coupler
• Industry Standard SOIC-8 Surface
   Mountable Package
• Standard Lead Spacing, .05"
• Available in Tape and Reel (suffix T)
   (Conforms to EIA Standard RS481A)
• Compatible with Dual Wave, Vapor Phase
   and IR Reflow Soldering
• Underwriters Lab File #E52744
   (Code Letter P)

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