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PZT2907AT3

  

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PZT2907AT3 [PNP Silicon Epitaxial Transistor ]

other parts : PZT2907AT1 

ON-Semiconductor
ON Semiconductor

This PNP Silicon Epitaxial transistor is designed for use in linear and switching applications. The device is housed in the SOT-223 package which is designed for medium power surface mount
applications.

Features
• NPN Complement is PZT2222AT1
• The SOT-223 Package can be Soldered Using Wave or Reflow
• SOT-223 Package Ensures Level Mounting, Resulting in Improved Thermal Conduction, and Allows Visual Inspection of Soldered Joints. The Formed Leads Absorb Thermal Stress during Soldering Eliminating the Possibility of Damage to the Die

This PNP Silicon Epitaxial transistor is designed for use in linear and switching applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications.

Features
• NPN Complement is PZT2222AT1
• The SOT-223 package can be soldered using wave or reflow
• SOT-223 package ensures level mounting, resulting in improved
   thermal conduction, and allows visual inspection of soldered joints.
   The formed leads absorb thermal stress during soldering eliminating
   the possibility of damage to the die.
• AEC−Q101 Qualified and PPAP Capable
• S Prefix for Automotive and Other Applications Requiring Unique
   Site and Control Change Requirements
• Pb−Free Packages are Available*

 

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PZT2907AT3G [PNP Silicon Epitaxial Transistor ]

other parts : PZT2907A  PZT2907AT1G  SPZT2907AT1G 

ON-Semiconductor
ON Semiconductor

This PNP Silicon Epitaxial transistor is designed for use in linear and switching applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications.

Features
• NPN Complement is PZT2222AT1
• The SOT-223 Package can be Soldered Using Wave or Reflow
• SOT-223 Package Ensures Level Mounting, Resulting in Improved
   Thermal Conduction, and Allows Visual Inspection of Soldered
   Joints. The Formed Leads Absorb Thermal Stress during Soldering
   Eliminating the Possibility of Damage to the Die
• S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant*

 

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