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C5750X6S0G100J [MULTILAYER CERAMIC CHIP CAPACITORS ]

other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G 

TDK
TDK Corporation

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets

View
C2012C0G0G100J [MULTILAYER CERAMIC CHIP CAPACITORS ]

other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G 

TDK
TDK Corporation

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets

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WF7NC35S100J_2009 [thermal fuse built-in resistor ]

other parts : WF10N_2009  WF5N_2009  WF7N_2009  WF5NC8G100J_2009  WF5NC8G100K_2009  WF5NC8S100J_2009  WF5NC8S100K_2009 

KOA
KOA Speer Electronics, Inc.

features
• Marking: Ceramic body with alpha/numeric marking
• Products with lead-free terminations meet EU RoHS requirements. Pb located in glass material, electrode and resistor element is exempt per Annex 1, exemption 5 of EU directive 2005/95/EC

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C4532CH1V100J [MULTILAYER CERAMIC CHIP CAPACITORS ]

other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G 

TDK
TDK Corporation

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets

View
C1005X6S1V100J [MULTILAYER CERAMIC CHIP CAPACITORS ]

other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G 

TDK
TDK Corporation

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets

View
C3216X7S1H100J [MULTILAYER CERAMIC CHIP CAPACITORS ]

other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G 

TDK
TDK Corporation

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets

View
C0603JB1H100J [MULTILAYER CERAMIC CHIP CAPACITORS ]

other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G 

TDK
TDK Corporation

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets

View
IDT7132SA100J [HIGH-SPEED 2K x 16 CMOS DUAL-PORT STATIC RAMS ]

other parts : IDT7132  IDT7132LA  IDT7132SA  IDT7142  IDT7142LA  IDT7142SA  IDT7132LA20P 

IDT
Integrated Device Technology

Description
The IDT7132/IDT7142 are high-speed 2K x 8 Dual-Port Static RAMs. The IDT7132 is designed to be used as a stand-alone 8-bit Dual-Port RAM or as a “MASTER” Dual-Port RAM together with the IDT7142 “SLAVE” Dual-Port in 16-bit-or-more word width systems. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 16-or-more-bit memory system applications results in full-speed, error-free operation without the need for additional discrete logic.
Both devices provide two independent ports with separate control, address, and l/O pins that permit independent, asynchronous access for reads or writes to any location in memory. An automatic power down feature, controlled byCEpermits the on-chip circuitry of each port to enter a very low standby power mode.
Fabricated using IDT’s CMOS high-performance technology, these devices typically operate on only 325mW of power. Low-power (LA) versions offer battery backup data retention capability, with each Dual Port typically consuming 200µW from a 2V battery.
The IDT7132/7142 devices are packaged in a 48-pin sidebraze or plastic DIPs, 48-pin LCCs, 52-pin PLCCs, and 48-lead flatpacks. Military grade product is manufactured in compliance with the latest revision of MIL-PRF-38535 QML, making it ideally suited to military temperature applications demanding the highest level of performance and reliability.

Features
◆ High-speed access
   – Commercial: 20/25/35/55/100ns (max.)
   – Industrial: 25ns (max.)
   – Military: 25/35/55/100ns (max.)
◆ Low-power operation
   – IDT7132/42SA
      Active: 325mW (typ.)
      Standby: 5mW (typ.)
   – IDT7132/42LA
      Active: 325mW (typ.)
      Standby: 1mW (typ.)
◆ MASTER IDT7132 easily expands data bus width to 16-or-more bits using SLAVE IDT7142
◆ On-chip port arbitration logic (IDT7132 only)
◆ BUSY output flag on IDT7132; BUSY input on IDT7142
◆ Battery backup operation —2V data retention (LA only)
◆ TTL-compatible, single 5V ±10% power supply
◆ Available in 48-pin DIP, LCC and Flatpack, and 52-pin PLCC packages
◆ Military product compliant to MIL-PRF-38535 QML
◆ Industrial temperature range (–40°C to +85°C) is available for selected speeds

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C2012X6S1E100J [MULTILAYER CERAMIC CHIP CAPACITORS ]

other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G 

TDK
TDK Corporation

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets

View
C0402C0G1E100J [MULTILAYER CERAMIC CHIP CAPACITORS ]

other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G 

TDK
TDK Corporation

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets

View
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