Integrated circuits, Transistor, Semiconductors Free Datasheet Search and Download Site


2SC

  

Datasheet

Match, Like N/A
Start with 2SC-* 2SC0* 2SC1* 2SC2* 2SC3* 2SC4* 2SC5* 2SC6* 2SC7* 2SC8* 2SC9* 2SCF*
End *02SC *22SC *12SC *52SC *32SC *62SC *82SC *92SC *P2SC *-2SC *42SC *D2SC *72SC *B2SC *M2SC *C2SC *F2SC *L2SC *T2SC *S2SC *V2SC
Included *2SC(* *2SC-* *2SC/* *2SC0* *2SC1* *2SC2* *2SC3* *2SC4* *2SC5* *2SC6* *2SC7* *2SC8* *2SC9* *2SCA* *2SCB* *2SCC* *2SCD* *2SCF* *2SCG* *2SCH* *2SCI* *2SCJ* *2SCL* *2SCN* *2SCP* *2SCQ* *2SCR* *2SCS* *2SCT* *2SCU* *2SCX* *2SC_*
View Details    
1812SC472KAT2ASB [High Voltage MLC Chips For 600V to 5000V Applications ]

other parts : 1812AA271JA11A  1812AA271JA12A  1812AA271JA13A  1812AA271JA14A  1812AA271JAT1A  1812AA271JAT2A  1812AA271JAT3A  1812AA271JAT4A  1812AA271KA11A  1812AA271KA12A 

AVX
AVX Corporation

High Voltage MLC Chips
For 600V to 5000V Applications

High value, low leakage and small size are difficult parameters to obtain in capacitors for high voltage systems. AVX special high voltage MLC chip capacitors meet these performance characteristics and are designed for applications such as snubbers in high frequency power converters, resonators in SMPS, and high voltage coupling/dc blocking. These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make high voltage MLC chip products. Special precautions must be taken in applying these chips in surface mount assemblies. The temperature gradient during heating or cooling cycles should not exceed 4ºC per second. The preheat temperature must be within 50ºC of the peak temperature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent externalarcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either thru-hole or SMT configurations (for details see section on high voltage leaded MLCchips).

View
P2102SC60TP [275 V, two-chip sidactor device ]

other parts : A1806AA3AP  A1806AA3RP  A1806AA3TP  A1806AA4AP  A1806AA4RP  A1806AA4TP  A1806AA6AP  A1806AA6RP  A1806AA6TP  A1806AB3AP 

Teccor-Electronics
Teccor Electronics

Product Description
SIDACtor components are solid state crowbar devices designed to protect telecom equipment during hazardous transient conditions. Capitalizing on the latest in thyristor advancements, Teccor makes SIDACtor devices with a patented ion implant technology. This technology ensures effective protection within nanoseconds, up to 5000 A surge current ratings, and simple solutions for regulatory requirements such as GR 1089, TIA-968 (formerly known as FCC Part 68), ITU-T K.20, ITU-T K.21, and UL 60950.

Advantages
  Compared to surge suppression using other technologies, SIDACtor devices offer absolute surge protection regardless of the surge current available and the rate of applied voltage (dv/dt). SIDACtor devices:
• Cannot be damaged by voltage
• Eliminate hysteresis and heat dissipation typically found with clamping devices
• Eliminate voltage overshoot caused by fast-rising transients
• Are non-degenerative
• Will not fatigue
• Have low capacitance, making them ideal for high-speed transmission equipment

Applications
  When protecting telecommunication circuits, SIDACtor devices are connected across Tip and Ring for metallic protection and across Tip and Ground and Ring and Ground for longitudinal protection. They typically are placed behind some type of current-limiting device, such as Teccor’s F1250T Telelink slow blow fuse. Common applications include:
• Central office line cards (SLICs)
• T-1/E-1, ISDN, and xDSL transmission equipment
• Customer Premises Equipment (CPE) such as phones, modems, and caller ID adjunct boxes
• PBXs, KSUs, and other switches
• Primary protection including main distribution frames, five-pin modules, building entrance equipment, and station protection modules
• Data lines and security systems
• CATV line amplifiers and power inserters
• Sprinkler systems

 

View
74F192SCQB [Up/Down Decade Counter with Separate Up/Down Clocks ]

other parts : 54F192  54F192DC  54F192DCQB  54F192DCX  54F192DM  54F192DMQB  54F192DMX  54F192FC  54F192FCQB  54F192FCX 

National-Semiconductor
National ->Texas Instruments

General Description
The ’F192 is an up/down BCD decade (8421) counter. Separate Count Up and Count Down Clocks are used, and in either counting mode the circuits operate synchronously. The outputs change state synchronously with the LOW-to HIGH transitions on the clock inputs.
Separate Terminal Count Up and Terminal Count Down outputs are used as the clocks for a subsequent stage without extra logic, thus simplifying multistage counter designs. Individual preset inputs allow the circuit to be used as a programmable counter. Both the Parallel Load (PL) and the Master Reset (MR) inputs asynchronously override the clocks.

Features
■ Guaranteed 4000V minimum ESD protection

 

View
1812SC472KAT3A [High Voltage MLC Chips For 600V to 5000V Applications ]

other parts : 1812AA271JA11A  1812AA271JA12A  1812AA271JA13A  1812AA271JA14A  1812AA271JAT1A  1812AA271JAT2A  1812AA271JAT3A  1812AA271JAT4A  1812AA271KA11A  1812AA271KA12A 

AVX
AVX Corporation

High Voltage MLC Chips
For 600V to 5000V Applications

High value, low leakage and small size are difficult parameters to obtain in capacitors for high voltage systems. AVX special high voltage MLC chip capacitors meet these performance characteristics and are designed for applications such as snubbers in high frequency power converters, resonators in SMPS, and high voltage coupling/dc blocking. These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make high voltage MLC chip products. Special precautions must be taken in applying these chips in surface mount assemblies. The temperature gradient during heating or cooling cycles should not exceed 4ºC per second. The preheat temperature must be within 50ºC of the peak temperature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent externalarcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either thru-hole or SMT configurations (for details see section on high voltage leaded MLCchips).

View
P1202SC61AP [100 mA, battrax quad negative SLIC protector ]

other parts : A1220UC4  A1225UA4  A1225UB4  A1225UC4  A1806AA3  A1806AA4  A1806AA6  A1806AB3  A1806AB4  A1806AB6 

Teccor-Electronics
Teccor Electronics

Product Description
SIDACtorcomponents are solid state crowbar devices designed to protect telecom equipment during hazardous transient conditions. Capitalizing on the latest in thyristor advancements, Teccor makes SIDACtordevices with a patented ion implant technology. This technology ensures effective protection within nanoseconds, up to 5000 A surge current ratings, and simple solutions for regulatory requirements such as GR 1089, TIA-968 (formerly known as FCC Part 68), ITU-T K.20, ITU-T K.21, and UL 60950.

Advantages
Compared to surge suppression using other technologies, SIDACtordevices offer absolute surge protection regardless of the surge current available and the rate of applied voltage (dv/dt). SIDACtordevices:

•  Cannot be damaged by voltage
•  Eliminate hysteresis and heat dissipation typically found with clamping devices
•  Eliminate voltage overshoot caused by fast-rising transients
•  Are non-degenerative
•  Will not fatigue
•  Have low capacitance, making them ideal for high-speed transmission equipment

Applications
When protecting telecommunication circuits, SIDACtordevices are connected across Tip and Ring for metallic protection and across Tip and Ground and Ring and Ground for longitudinal protection. They typically are placed behind some type of current-limiting device, such as Teccor’s F1250T Telelinkslow blow fuse. Common applications include:

•  Central office line cards (SLICs)
•  T-1/E-1, ISDN, and xDSL transmission equipment
•  Customer Premises Equipment (CPE) such as phones, modems, and caller ID adjunct boxes
•  PBXs, KSUs, and other switches
•  Primary protection including main distribution frames, five-pin modules, building entrance equipment, and station protection modules
•  Data lines and security systems
•  CATV line amplifiers and power inserters
•  Sprinkler systems

View
LH28F002SCB-L12 [2-MBIT(256KBx8) SmartVoltage Flash MEMORY ]

other parts : LH28F002SCH-L  LH28F002SCT-L85  LH28F002SCT-L90  LH28F002SCT-L120  LH28F002SCT-L150  LH28F002SCT-L12  LH28F002SCT-L170  LH28F002SCN-L85  LH28F002SCN-L90  LH28F002SCN-L120 

Sharp
Sharp Electronics


View
54F132SCQB [Quad 2-Input NAND Schmitt Trigger ]

other parts : 54F132  54F132DM  54F132FM  54F132LM  74F132  74F132PC  74F132SC  74F132SJ  74F132SJX  54F132PCX 

TI
Texas Instruments

General Description
The ’F132 contains four 2-input NAND gates which accept standard TTL input signals and provide standard TTL output levels. They are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. In addition, they have a greater noise margin than conventional NAND gates.
Each circuit contains a 2-input Schmitt trigger followed by level shifting circuitry and a standard FAST® output structure. The Schmitt trigger uses positive feedback to effectively speed-up slow input transitions, and provide different input threshold voltages for positive and negative-going transitions. This hysteresis between the positive-going and negative-going input threshold (typically 800 mV) is determined by resistor ratios and is essentially insensitive to temperature and supply voltage variations.

Features
■ Guaranteed 4000V minimum ESD protection
■ Standard Military Drawing (SMD)
■ 5962-89487

View
ST2SC3112 [NPN Silicon Epitaxial Planar Transistor ]

other parts : 2SC3112  C3112 

Semtech
Semtech Corporation

for general purpose and switching applications.

View
1812SC472KAT3ASB [High Voltage MLC Chips For 600V to 5000V Applications ]

other parts : 1812AA271JA11A  1812AA271JA12A  1812AA271JA13A  1812AA271JA14A  1812AA271JAT1A  1812AA271JAT2A  1812AA271JAT3A  1812AA271JAT4A  1812AA271KA11A  1812AA271KA12A 

AVX
AVX Corporation

High Voltage MLC Chips
For 600V to 5000V Applications

High value, low leakage and small size are difficult parameters to obtain in capacitors for high voltage systems. AVX special high voltage MLC chip capacitors meet these performance characteristics and are designed for applications such as snubbers in high frequency power converters, resonators in SMPS, and high voltage coupling/dc blocking. These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make high voltage MLC chip products. Special precautions must be taken in applying these chips in surface mount assemblies. The temperature gradient during heating or cooling cycles should not exceed 4ºC per second. The preheat temperature must be within 50ºC of the peak temperature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent externalarcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either thru-hole or SMT configurations (for details see section on high voltage leaded MLCchips).

View
P1552SC61AP [Teccor Electronics SIDACtor® Data Book and Design Guide ]

other parts : P1550AA  P1550AB  P1550AC  P1550AD  P1550AE  P1550CA  P1550CB  P1550CC  P1550CD  P1550CE 

Teccor-Electronics
Teccor Electronics

Product Description
SIDACtor components are solid state crowbar devices designed to protect telecom equipment during hazardous transient conditions. Capitalizing on the latest in thyristor advancements, Teccor makes SIDACtor devices with a patented ion implant technology. This technology ensures effective protection within nanoseconds, up to 5000 A surge current ratings, and simple solutions for regulatory requirements such as GR 1089, TIA-968 (formerly known as FCC Part 68), ITU-T K.20, ITU-T K.21, and UL 60950.

Advantages
Compared to surge suppression using other technologies, SIDACtor devices offer absolute surge protection regardless of the surge current available and the rate of applied voltage (dv/dt). SIDACtor devices:
• Cannot be damaged by voltage
• Eliminate hysteresis and heat dissipation typically found with clamping devices
• Eliminate voltage overshoot caused by fast-rising transients
• Are non-degenerative
• Will not fatigue
• Have low capacitance, making them ideal for high-speed transmission equipment

Applications
When protecting telecommunication circuits, SIDACtor devices are connected across Tip and Ring for metallic protection and across Tip and Ground and Ring and Ground for longitudinal protection. They typically are placed behind some type of current-limiting device, such as Teccor’s F1250T Telelink slow blow fuse. Common applications include:
• Central office line cards (SLICs)
• T-1/E-1, ISDN, and xDSL transmission equipment
• Customer Premises Equipment (CPE) such as phones, modems, and caller ID adjunct boxes
• PBXs, KSUs, and other switches
• Primary protection including main distribution frames, five-pin modules, building
   entrance equipment, and station protection modules
• Data lines and security systems
• CATV line amplifiers and power inserters
• Sprinkler systems

View
1 2 3 4 5 6 7 8 9 10 Next
Share Link : 

HOME




Language : 한국어     日本語     русский     简体中文     español
@ 2015 - 2018  [ Home ][ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]