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VI-JNTEM [MiniMod DC-DC Converters 25 to 100 Watts ]

other parts : VI-J00-CW-F1  VI-J00-CW-F2  VI-J00-CW-S  VI-J00-CX-F1  VI-J00-CX-F2  VI-J00-CX-S  VI-J00-CY-F1 

Vicor
Vicor

Features
■Up to 50W/Cubic Inch
■UL, CSA, TÜV, VDE, BABT
■CE Marked
■Up to 90% Efficiency
■Size: 2.28" x 2.4" x 0.5" (57,9 x 61,0 x 12,7)
■Remote Sense and Current Limit
■Logic Disable
■Wide Range Output Adjust
■ZCS Power Architecture
■Low Noise FM Control

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SN74ALS857NTE4 [HEX 2-TO-1 UNIVERSAL MULTIPLEXERS WITH 3-STATE OUTPUTS ]

other parts : 5962-87533013A  5962-8753301LA  SN54ALS857  SN54ALS857FK  SN54ALS857JT  SN74ALS857  SN74ALS857DW 

TI
Texas Instruments

description
The ′ALS857 are hextuple 2-line to 1-line multiplexers with 3-state outputs. The devices can provide either true (COMP low) or inverted (COMP high) data at the Y outputs. In addition, the ′ALS857 perform the logical AND function (A • B) and the clear function as well. The four modes of operation are:
  • Select A-data inputs
  • Select B-data inputs
  • AND A inputs with B inputs
  • Clear
 
• Select True or Complementary Data
• Perform AND/NAND (Masking) of A or B Operand
• Cascadable to Expand Number of Operands
• Detect Zeros on A or B Operands
• 3-State Outputs Interface Directly With System Bus
• Package Options Include Plastic
   Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (JT) 300-mil DIPs

 

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SN74BCT646NTE4 [OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS ]

other parts : 5962-9155501M3A  5962-9155501MLA  BCT646  SN54BCT646  SN54BCT646FK  SN54BCT646JT  SN54BCT646W 

TI
Texas Instruments

description/ordering information
These devices consist of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the ’BCT646 devices.

State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
Bus Transceivers/Registers
Independent Registers and Enables for A and B Buses
Multiplexed Real-Time and Stored Data
ESD Protection Exceeds JESD 22
  − 2000-V Human-Body Model (A114-A)
  − 200-V Machine Model (A115-A)

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SN74BCT8373ANTE4 [SCAN TEST DEVICES WITH OCTAL D-TYPE LATCHES ]

other parts : 5962-9172501M3A  5962-9172501MLA  BCT8373A  SN54BCT8373A  SN54BCT8373AFK  SN54BCT8373AJT  SN74BCT8373A 

TI
Texas Instruments

description
The ’BCT8373A scan test devices with octal D-type latches are members of the Texas Instruments SCOPE testability integrated circuit family. This family of devices supports IEEE Standard 1149.1-1990 boundary scan to facilitate testing of complex circuit board assemblies. Scan access to the test circuitry is accomplished via the 4-wire test access port (TAP) interface.

Members of the Texas Instruments SCOPEFamily of Testability Products
Octal Test-Integrated Circuits
Functionally Equivalent to ’F373 and ’BCT373 in the Normal-Function Mode
Compatible With the IEEE Standard  1149.1-1990 (JTAG) Test Access Port and  Boundary-Scan Architecture
Test Operation Synchronous to Test Access Port (TAP)
Implement Optional Test Reset Signal by  Recognizing a Double-High-Level Voltage  (10 V) on TMS Pin
SCOPEInstruction Set
  – IEEE Standard 1149.1-1990 Required Instructions, Optional INTEST, CLAMP, and HIGHZ
  – Parallel Signature Analysis at Inputs
  – Pseudo-Random Pattern Generation From Outputs
  – Sample Inputs/Toggle Outputs
Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT)

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CG2350LSNTE_2009 [Gas Discharge Tube (GDT) Products CG/CG2 Series ]

other parts : CG1000L_2009  CG1000LS_2009  CG1000MS_2009  CG1000MSTR_2009  CG1000SN_2009  CG1000SNL_2009  CG1000SNLS_2009 

Littelfuse
Littelfuse, Inc

Description
Littelfuse highly reliable CG/CG2 Series GDTs provide a high degree of surge protection in a small size ideal for board level circuit protection.
GDTs function as switches which dissipate a minimum amount of energy and therefore handle currents that far surpass other types of transient voltage protection. Their gas-flled, rugged ceramic metal construction make them well suited to adverse environments.
The CG/CG2 series comes in a variety of forms including surface mount, core, straight and shaped leads, to serve a variety of mounting methods.
The CG Series (75-110V) is ideal for protection of test and communication equipment and other devices in which low voltage limits and extremely low arc voltages are required.
The CG2 Series (145V-1000V) is ideal for protecting equipment where higher voltage limits and holdover voltages are necessary.

Features
• Rugged Ceramic-Metal construction
• Low Capacitance (<1.5pf)
• Meets REA PE-80
• Available in surface mount, and a variety of lead options options

Applications
• Communication lines and equipment
• CATV equipment
• Test equipment
• Data lines
• Power supplies
• Instrumentation circuits
• Medical electronics
• ADSL equipment
• Telecom SLIC protection

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HSC-INTERFACEBOARD_2000 [1.75 MSPS, 4 mW 10-Bit/12-Bit Parallel ADCs ]

other parts : AD7470_2000  AD7470ARU_2000  AD7472_2000  AD7472AR_2000  AD7472ARU_2000  AD7472BR_2000  AD7472BRU_2000 

ADI
Analog Devices

GENERAL DESCRIPTION
The AD7470/AD7472 are 10-bit/12-bit high speed, low power, successive approximation ADCs. The parts operate from a single 2.7 V to 5.25 V power supply and feature throughput rates up to 1.5 MSPS for the 12-bit AD7472 and up to 1.75 MSPS for the 10-bit AD7470. The parts contain a low noise, wide bandwidth track-and-hold amplifier that can handle input frequencies in excess of 1 MHz.
The AD7470/AD7472 use advanced design techniques to achieve very low power dissipation at high throughput rates. With 3 V supplies and 1.5 MSPS throughput rates, the AD7470 typically consumes, on average, just 1.1 mA. With 5 V supplies and 1.75 MSPS, the average current consumption is typically 1.6 mA. The part also offers flexible power/throughput rate management. Operating the AD7470 with 3 V supplies and 500 kSPS throughput reduces the current consumption to 713 µA.
At 5 V supplies and 500 kSPS, the part consumes 944 µA.
It is also possible to operate the parts in an auto sleep mode, where the part wakes up to do a conversion and automatically enters sleep mode at the end of conversion. This method allows very low power dissipation numbers at lower throughput rates. In this mode, the AD7472 can be operated with 3 V supplies at 100 kSPS, and consume an average current of just 124 µA. At 5 V supplies and 100 kSPS, the average current consumption is 171 µA.

FEATURES
   Specified for VDD of 2.7 V to 5.25 V
   1.75 MSPS for AD7470 (10-Bit)
   1.5 MSPS for AD7472 (12-Bit)
   Low Power
      AD7470:
         3.34 mW Typ at 1.5 MSPS with 3 V Supplies
         7.97 mW Typ at 1.75 MSPS with 5 V Supplies
      AD7472:
         3.54 mW Typ at 1.2 MSPS with 3 V Supplies
         8.7 mW Typ at 1.5 MSPS with 5 V Supplies
   Wide Input Bandwidth
   70 dB Typ SNR at 500 kHz Input Frequency
   Flexible Power/Throughput Rate Management
   No Pipeline Delays
   High Speed Parallel Interface
   Sleep Mode: 50 nA Typ
   24-Lead SOIC and TSSOP Packages

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SN74BCT29827BNTE4 [10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS ]

other parts : SN54BCT29827B  SN54BCT29827BFK  SN54BCT29827BJT  SN74BCT29827B  SN74BCT29827BDW  SN74BCT29827BDWE4  SN74BCT29827BDWR 

TI
Texas Instruments

description
These 10-bit buffers and bus drivers provide high-performance bus interface for wide data paths or buses carrying parity.

State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
P-N-P Inputs Reduce DC Loading
Flow-Through Architecture Optimizes PCB Layout
Package Options Include Plastic
Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs(JT, NT)

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SN74BCT8244ANTE4 [SCAN TEST DEVICES WITH OCTAL BUFFERS ]

other parts : 5962-9172601M3A  5962-9172601MLA  BCT8244A  SN54BCT8244A  SN54BCT8244AFK  SN54BCT8244AJT  SN74BCT8244A 

TI
Texas Instruments

description
The ’BCT8244A scan test devices with octal buffers are members of the Texas Instruments SCOPE™ testability integrated-circuit family. This family of devices supports IEEE Standard 1149.1-1990 boundary scan to facilitate testing of complex circuit-board assemblies. Scan access to the test circuitry is accomplished via the 4-wire test access port (TAP) interface.

Members of the Texas Instruments SCOPE™Family of Testability Products
Octal Test-Integrated Circuits
Functionally Equivalent to ’F244 and ’BCT244 in the Normal-Function Mode
Compatible With the IEEE Standard 1149.1-1990 (JTAG) Test Access Port and Boundary-Scan Architecture
Test Operation Synchronous to Test Access Port (TAP)
Implement Optional Test Reset Signal by Recognizing a Double-High-Level Voltage (10 V) on TMS Pin
SCOPE™Instruction Set
  − IEEE Standard 1149.1-1990 Required Instructions, Optional INTEST, CLAMP and HIGHZ
  − Parallel-Signature Analysis at Inputs
  − Pseudo-Random Pattern Generation From Outputs
  − Sample Inputs/Toggle Outputs
Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT)

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TMP422AMDCNTEP [±1°C REMOTE TEMPERATURE AND ±2.5°C LOCAL TEMPERATURE SENSOR IN SOT23-8 ]

other parts : TMP422-EP  V62/11618-01XE 

TI
Texas Instruments

DESCRIPTION
The TMP422 is a remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature sensor diode-connected transistors are typically low-cost, NPN- or PNP-type transistors or diodes that are an integral part of microcontrollers, microprocessors, or FPGAs.
Remote accuracy is ±1°C for multiple IC manufacturers, with no calibration needed. The two-wire serial interface accepts SMBus write byte, read byte, send byte, and receive byte commands to configure the device.

FEATURES
• SOT23-8 Package
• ±1°C Remote Diode Sensor (Max)
• ±2.5°C Local Temperature Sensor (Max)
• Series Resistance Cancellation
• n-Factor Correction
• Two-Wire/ SMBus™ Serial Interface
• Multiple Interface Addresses
• Diode Fault Detection
• RoHS Compliant and NO Sb/Br

APPLICATIONS
• Processor/FPGA Temperature Monitoring
• LCD/ DLP®/LCOS Projectors
• Servers
• Central Office Telecom Equipment
• Storage Area Networks (SAN)

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SN74ALS869NTE4 [SYNCHRONOUS 8-BIT UP/DOWN COUNTERS ]

other parts : 5962-8952601LA  5962-8966801LA  SN54AS867  SN54AS867FK  SN54AS867JT  SN54AS869  SN54AS869FKA 

TI
Texas Instruments

description
These synchronous, presettable, 8-bit up/down counters feature internal-carry look-ahead circuitry for cascading in high-speed counting applications. Synchronous operation is provided by having all flip-flops clocked simultaneously so that the outputs change coincidentally with each other when so instructed by the count-enable (ENP, ENT) inputs and internal gating. This mode of operation eliminates the output counting spikes normally associated with asynchronous (ripple clock) counters. A buffered clock (CLK) input triggers the eight flip-flops on the rising (positive going) edge of the clock waveform.

• Fully Programmable With Synchronous Counting and Loading
• SN74ALS867A and ′AS867 Have Asynchronous Clear; SN74ALS869 and ′AS869 Have Synchronous Clear
• Fully Independent Clock Circuit Simplifies Use
• Ripple-Carry Output for n-Bit Cascading
• Package Options Include Plastic
   Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (JT) 300-mil DIPs

 

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