Fine Pitch SMT Stacking Connectors (Parallel Board-to-Board)
Tyco Electronics 0.8mm FH surface-mount connectors are designed for parallel board stacking applications using subminiature connectors to meet today’s electronic industry requirements for high density packaging.
It is possible to save more than 50% of the required board space when compared to conventional 1.27 [.050] centerline connectors.
Product Facts
â For parallel board stacking applications
â High density packaging on 0.8 [.031] centerline spacing
â Available sizes from 40 to 200 positions (in 20 position increments)
â Board stacking heights available from 5 [.197] to 16 [.630] (in 1 [.039] increments)
â Bellows type spring contacts are resistant to scooping and stubbing during mating and unmating
â Positioning bosses for proper on-board orientation
â Available packaged on“tape-and-reel” for automatic placement per EIA standards
â Recognized under the Component Program of Underwriter Laboratories Inc., File No. E28476
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