Features
⢠Epitaxial Planar Die Construction
⢠Ideally Suited for Automated Assembly Processes
⢠Ideal for Medium Power Switching or Amplification Applications
⢠Complementary NPN Type (2DD2679) Available
⢠Lead Free By Design/RoHS Compliant
⢠"Green" Device
Mechanical Data
⢠Case: SOT89-3L
⢠Case Material: Molded Plastic, "Greenâ Molding Compound.
UL Flammability Classification Rating 94V-0
⢠Moisture Sensitivity: Level 1 per J-STD-020D
⢠Terminals: Finish â Matte Tin annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
⢠Marking Information: See Page 4
⢠Ordering Information: See Page 4
⢠Weight: 0.072 grams (approximate)
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