BYD1100 Datasheet - Philips Electronics
Part Name
BYD1100
Description
Other PDF
not available.
PDF
page
12 Pages
File Size
62.5 kB
MFG CO.
Philips Electronics
DESCRIPTION
Cavity free cylindrical glass package through Implotecâ¢(1) technology.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
⢠Glass passivated
⢠High maximum operating
temperature
⢠Low leakage current
⢠Excellent stability
⢠Smallest surface mount rectifier
outline
⢠Shipped in 8 mm embossed tape.
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