BYD71 Datasheet - Philips Electronics
Part Name
BYD71
Other PDF
not available.
PDF
page
11 Pages
File Size
71.3 kB
MFG CO.
Philips Electronics
DESCRIPTION
Cavity free cylindrical SOD91 glass package through Implotec™(1) technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack.
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PDF
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