DESCRIPTION
DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
   
FEATURES
• Glass passivated
• High maximum operating
    temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
    absorption capability
• UL 94V-O classified plastic
    package
• Shipped in 12 mm embossed tape.