DESCRIPTION
DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
FEATURES
⢠Glass passivated
⢠High maximum operating
temperature
⢠Low leakage current
⢠Excellent stability
⢠Guaranteed avalanche energy
absorption capability
⢠UL 94V-O classified plastic
package
⢠Shipped in 12 mm embossed tape.
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