FEATURES
• Low profile package
• Ideal for automated placement
• Guardring for overvoltage protection
• Low power losses, high efficiency
• Very low switching losses
• High surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
    peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
    and WEEE 2002/96/EC
   
TYPICAL APPLICATIONS
    For use in high frequency inverters, switching power
    supplies, freewheeling diodes, OR-ing diode, dc-to-dc
    converters and reverse battery protection.