FEATURES
⢠Power pack
⢠Glass passivated pellet chip junction
⢠Ultrafast recovery time
⢠Low switching losses, high efficiency
⢠Low forward voltage drop
⢠High forward surge capability
⢠Meets MSL level 1, per J-STD-020, LF maximum peak of
245 °C (for TO-263AB package)
⢠Solder dip 275 °C max. 10 s, per JESD 22-B106
(for TO-220AC and ITO-220AC package)
⢠AEC-Q101 qualifiedï
(for ITO-220AC and TO-263AB package)
⢠Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
For use in high frequency rectifier of switching mode
power supplies, inverters, freewheeling diodes, DC/DC
converters, and other power switching application.
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