FEATURES
⢠Glass passivated chip junction
⢠Ultrafast recovery time
⢠Low switching losses, high efficiency
⢠Low forward voltage drop
⢠High forward surge capability
⢠Meets MSL level 1, per J-STD-020, LF maximum
peak of 245 °C (for TO-263AB package)
⢠Solder dip 260 °C, 40 s (for TO-220AC and
ITO-220AC package)
⢠Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For use in high frequency rectifier of switching mode
power supplies, inverters, freewheeling diodes,
dc-to-dc converters, and other power switching
application.
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