CP214 Datasheet PDF - Central Semiconductor

CP214 Datasheet - Central Semiconductor

Part Name

CP214

Description

Small Signal Transistor NPN - Silicon RF Transistor Chip

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page

2 Pages

File Size

192.6 kB

MFG CO.

Central Semiconductor

PROCESS DETAILS

Process EPITAXIAL PLANAR
Die Size 16 x 16 MILS
Die Thickness 7.5 MILS
Base Bonding Pad Area 2.9 x 3.4 MILS
Emitter Bonding Pad Area 2.9 x 3.4 MILS
Top Side Metalization Al - 20,000Ã
Back Side Metalization Au - 16,000Ã

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