Features
⢠Glass passivated chip junctions
⢠Ideal for automated placement
⢠Ultrafast reverse recovery time for high efficiency
⢠Low profile package
⢠High forward surge capability
⢠High temperature soldering: 260°C/10 seconds at terminals
⢠Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC
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