General Description
Combining Fairchildâs advanced 2.5V specified PowerTrench process with state-of-the-art BGA packaging, the FDZ201N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).
Features
⢠9 A, 20 V. RDS(ON) = 0.018 ⦠@ VGS = 4.5 V
RDS(ON) = 0.030 ⦠@ VGS = 2.5 V.
⢠Occupies only 5 mm2 of PCB area.
Only 55% of the area of SSOT-6
⢠Ultra-thin package: less than 0.70 mm height when
mounted to PCB
⢠Outstanding thermal transfer characteristics:
4 times better than SSOT-6
⢠Ultra-low Qg x RDS(ON) figure-of-merit.
⢠High power and current handling capability.
Applications
⢠Battery management
⢠Load switch
⢠Battery protection
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