Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and rDS(on). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra low profile packaging, low gate charge, and low rDS(on).
• –13 A, –20 V.
rDS(on) = 9.5 mW @ VGS = –4.5 V
rDS(on) = 14.5 mW @ VGS = –2.5 V
• Occupies only 14 mm2 of PCB area.
Only 42% of the area of SO-8
• Ultra-thin package: less than 0.80 mm height when mounted to PCB
• 0.65 mm ball pitch
• 3.5 x 4 mm2 footprint
• High power and current handling capability
• Battery management
• Load switch
• Battery protection