New/Featured Product
Amphenol’s HDB3 High Density Brush Series with Tighter (.070 inch X .060 inch) Staggered Grid Spacing

This new connector series of brush connectors incorpo rates a higher density contact pattern and lower mated height than Amphenol’s standard low mating force rectangular connectors. HDB3 connectors utilize the same durable and reliable B3 brush contact in a tighter .070” X .060” staggered grid pattern.

HDB3 Advantages over Competitive Connectors:
• Higher density contact pattern
• Uses less board space
• Allows for shorter mated height
• Provides the durability and performance of the Brush contact
• Low cost

Mates with:
• Daughter Board
• I/O
• Stacker

HSB3 - HIGH SPEED SERIES 6.250 GBS

High speed confguration available that allows data rates up to 6.250 Gb/s via 100 ohm matched impedance differential pairs.
• Partially populated standard HDB3 mother board and daugher board bodies
• Contact an Amphenol sales engineer for validation results

Mates with:
• High Speed Daughter Board