New/Featured Product
Amphenolâs HDB3 High Density Brush Series with Tighter (.070 inch X .060 inch) Staggered Grid Spacing
This new connector series of brush connectors incorpo rates a higher density contact pattern and lower mated height than Amphenolâs standard low mating force rectangular connectors. HDB3 connectors utilize the same durable and reliable B3 brush contact in a tighter .070â X .060â staggered grid pattern.
HDB3 Advantages over Competitive Connectors:
⢠Higher density contact pattern
⢠Uses less board space
⢠Allows for shorter mated height
⢠Provides the durability and performance of the Brush contact
⢠Low cost
Mates with:
⢠Daughter Board
⢠I/O
⢠Stacker
HSB3 - HIGH SPEED SERIES 6.250 GBS
High speed confguration available that allows data rates up to 6.250 Gb/s via 100 ohm matched impedance differential pairs.
⢠Partially populated standard HDB3 mother board and daugher board bodies
⢠Contact an Amphenol sales engineer for validation results
Mates with:
⢠High Speed Daughter Board
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