Description
This HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in a wide variety of applications.
Features
⢠Advanced Process Technology
⢠Ultra Low On-Resistance
⢠175°C Operating Temperature
⢠Fast Switching
⢠Repetitive Avalanche Allowed up to Tjmax
⢠Lead-Free
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