The 4Gb DDR3 SDRAM B-die is organized as a 32Mbit x 16 I/Os x 8banks, device. This synchronous device achieves high speed double-data-rate transfer rates of up to 2133Mb/sec/pin (DDR3-2133) for general applications.
Key Features
⢠JEDEC standard 1.5V(1.425V~1.575V)
⢠VDDQ = 1.5V(1.425V~1.575V)
⢠400 MHz fCK for 800Mb/sec/pin, 533MHz fCK for 1066Mb/sec/pin,
667MHz fCK for 1333Mb/sec/pin, 800MHz fCK for 1600Mb/sec/pin,
933MHz fCK for 1866Mb/sec/pin, 1066 MHz fCK for 2133Mb/sec/pin
⢠8 Banks
⢠Programmable CAS Latency(posted CAS): 5,6,7,8,9,10,11,12,13,14
⢠Programmable Additive Latency: 0, CL-2 or CL-1 clock
⢠Programmable CAS Write Latency (CWL) = 5 (DDR3-800), 6
(DDR3-1066), 7 (DDR3-1333) , 8 (DDR3-1600), 9 (DDR3-1866) and
10 (DDR3-2133)
⢠8-bit pre-fetch
⢠Burst Length: 8 (Interleave without any limit, sequential with starting
address â000â only), 4 with tCCD = 4 which does not allow seamless
read or write [either On the fly using A12 or MRS]
⢠Bi-directional Differential Data-Strobe
⢠Internal(self) calibration : Internal self calibration through ZQ pin
(RZQ : 240 ohm ± 1%)
⢠On Die Termination using ODT pin
⢠Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at
85°C < TCASE < 95 °C
⢠Support Industrial Temp ( -40 ⼠85°C )
⢠Asynchronous Reset
⢠Package : 96 balls FBGA - x16
⢠All of Lead-Free products are compliant for RoHS
⢠All of products are Halogen-free
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