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LP8755 Datasheet

Part NameLP8755 TI
Texas Instruments TI
DescriptionMulti-Phase 6-Core Step-Down Converter / 49-Bump 0.4 mm Pitch DSBGA Package
Link #0     
LP8755 image

The LP8755 is designed to meet the power management requirements of the latest applications processors in mobile phones and similar portable applications. The device contains six step-down DC/DC converter cores, which are bundled together in a 6-phase buck converter. The device is fully controlled by a SmartReflex™-compatible interface or an I2C-compatible serial interface.

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