FEATURES
â Low profile package
â For surface mounted applications
â Built-in strain relief, ideal for automated placement
â Plastic package has underwriters, laborator flammability classification 94V-0
â High temperature soldering: 260°C/10 seconds at terminals
MECHANICAL DATA
â Case :JEDEC SMA, molded plastic over ,passivated chip
â Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
â Weight: 0.002 ounces, 0.064 gram
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