Features:
● Super fast switching for high efficiency
● Low leakage current
● High forward surge capability
● Solder dip 260 °C, 40 s
● Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
● This is a Pb − Free Device
● All SMC parts are traceable to the wafer lot
● Additional testing can be offered upon request