Features:
â Super fast switching for high efficiency
â Low leakage current
â High forward surge capability
â Solder dip 260 °C, 40 s
â Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
â This is a Pb â Free Device
â All SMC parts are traceable to the wafer lot
â Additional testing can be offered upon request
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