DESCRIPTION
Third generation Power MOSFETs form Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The D2PAK is a surface mount power package capabel of the accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application. The through-hole version (IRFBF20L/SiHFBF20L) is available for low-profile applications.
FEATURES
⢠Surface Mount (IRFBF20S/SiHFBF20S)
⢠Low-Profile Through-Hole (IRFBF20L/SiHFBF20L)
⢠Available in Tape and Reel
(IRFBF20S/SiHFBF20S)
⢠Dynamic dV/dt Rating
⢠150 °C Operating Temperature
⢠Fast Switching
⢠Fully Avalanche Rated
⢠Lead (Pb)-free Available
|