FEATURES
• For surface mounted applications
• Ideal for automated placement
• Low power loss, high efficiency
• Oxide planar chip junction
• Meets MSL level 1, per J-STD-020, LF maximum
   peak of 260 °C
• Meets JESD 201 class 2 whisker test
• Wave and reflow solderable
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
   please see www.vishay.com/doc?99912