FEATURES
⢠For surface mounted applications
⢠Ideal for automated placement
⢠Low power loss, high efficiency
⢠Oxide planar chip junction
⢠Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
⢠Meets JESD 201 class 2 whisker test
⢠Wave and reflow solderable
⢠AEC-Q101 qualified
⢠Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
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