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HS9-6617RH-Q Datasheet - Intersil

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Description
MFG CO.
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Radiation Hardened 2K x 8 CMOS PROM

The Intersil HS-6617RH is a radiation hardened 16K CMOS PROM, organized in a 2K word by 8-bit format. The chip is manufactured using a radiation hardened CMOS process, and is designed to be functionally equivalent to the HM-6617. Synchronous circuit design techniques combine with CMOS processing to give this device high speed performance with very low power dissipation.

Features
• Electrically Screened to SMD # 5962-95708
• QML Qualified per MIL-PRF-38535 Requirements
• Total Dose . . . . . . . . . . . . . . . . . . . . . . 100 krad(Si) (Max)
• Latch-Up Free. . . . . . . . . . . . . . . . . . . .>1 x 1012 rad(Si)/s
• Field Programmable
• Functionally Equivalent to HM-6617
• Pin Compatible with Intel 2716
• Low Standby Power . . . . . . . . . . . . . . . . . . . 1.1mW (Max)
• Low Operating Power . . . . . . . . . . . .137.5mW/MHz (Max)
• Fast Access Time . . . . . . . . . . . . . . . . . . . . . .100ns (Max)
• TTL Compatible Inputs/Outputs
• Synchronous Operation
• On Chip Address Latches
• Three-State Outputs
• Nicrome Fuse Links
• Easy Microprocessor Interfacing
• Military Temperature Range . . . . . . . . . . . -55°C to 125°C

Page Link's: 1  2  3  4  5 
 

Part Name
Description
PDF
MFG CO.
Radiation Hardened 2K x 8 CMOS PROM
Intersil
Radiation-Hardened 32K x 8 PROM
Aeroflex Corporation
Radiation-Hardened 8K x 8 PROM
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Aeroflex UTMC
Radiation-Hardened 32K x 8 PROM
Aeroflex Corporation
Radiation-Hardened 8K x 8 PROM
Aeroflex UTMC
Radiation-Hardened 32K x 8 PROM
Aeroflex UTMC
Radiation-Hardened 8K x 8 PROM
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2K x 8 CMOS PROM
Intersil
2K x 8 CMOS PROM
Intersil

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