FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Available in uni-directional and bi-directional
• 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 %
• Excellent clamping capability
• Low inductance
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

TYPICAL APPLCIATIONS
   Use in sensitive electronics protection against Voltage Transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, and telecommunication.

FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Available in uni-directional and bi-directional
• 1500 W peak pulse power capability with a 10/1000 μs
    waveform, repetitive rate (duty cycle): 0.01 %
• Excellent clamping capability
• Low inductance
• Meets MSL level 1, per J-STD-020, LF maximum peak
    of 260 °C
• Material categorization: for definitions of compliance
    please see www.vishay.com/doc?99912
   
TYPICAL APPLICATIONS
    Use in sensitive electronics protection against Voltage
    Transients induced by inductive load switching and lighting
    on ICs, MOSFET, signal lines of sensor units for consumer,
    computer, industrial, and telecommunication.
   

FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Available in uni-directional and bi-directional
• 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 %
• Excellent clamping capability
• Very fast response time
• Low incremental surge resistance
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

TYPICAL APPLCIATIONS
    Use in sensitive electronics protection against Voltage Transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, and telecommunication.

FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Available in uni-directional and bi-directional
• 1500 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 %
• Excellent clamping capability
• Very fast response time
• Low incremental surge resistance
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• AEC-Q101 qualified available
   - Automotive ordering code: base P/NHE3 or P/NHM3
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS
   Use in sensitive electronics protection against Voltage Transients induced by inductive load switching and lightning on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, automotive, and telecommunication.

FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Available in uni-directional and bi-directional
• 600 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 %
• Excellent clamping capability
• Very fast response time
• Low incremental surge resistance
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS
   Use in sensitive electronics protection against Voltage Transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, automotive and telecommunication.

Features
• Underwriters Laboratory Recognition under UL standard
   for safety 497B: Isolated Loop Circuit Protection
• Low profile package with built-in strain relief for
   Surface Mounted applications
• Glass passivated junction
• Low incremental surge resistance, excellent clamping
   capability
• 1500W peak pulse power capability with a 10/1000µs
   waveform, repetition rate (duty cycle): 0.01%
• Very fast response time
• High temperature soldering guaranteed:
   250°C/10 seconds at terminals

FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Available in unidirectional and bidirectional
• 400 W peak pulse power capability with a
   10/1000 μs waveform, repetitive rate
   (duty cycle): 0.01 % (300 W above 91 V)
• Excellent clamping capability
• Very fast response time
• Low incremental surge resistance
• Meets MSL level 1, per J-STD-020, LF maximum peak
   of 260 °C
• AEC-Q101 qualified available
   - Automotive ordering code: P/NHE3 or P/NHM3
• Material categorization: for definitions of compliance
   please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS
   Use in sensitive electronics protection against Voltage
   transients induced by inductive load switching and lighting
   on ICs, MOSFET, signal lines of sensor units for consumer,
   computer, industrial, and telecommunication.

FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Available in uni-directional and bi-directional
• 400 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): lity
• Very fast response time
• Low incremental surge resistance
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• AEC-Q101 qualified
• Material categorization: For definitions of compliance please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS
    Use in sensitive electronics protection against Voltage Transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, automotive, and telecommunication.

FEATURES

• Very low profile - typical height of 1.0 mm

• Ideal for automated placement

• Available in uni-directional

• 400 W peak pulse power capability with a 10/1000 µs waveform

• Excellent clamping capability

• Very fast response time

• Low incremental surge resistance

• Meets MSL level 1, per J-STD-020

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Available in uni-directional and bi-directional
• 600 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 %
• Excellent clamping capability
• Very fast response time
• Low incremental surge resistance
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS
   Use in sensitive electronics protection against Voltage Transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, automotive and telecommunication.