ESDALC6V1M3 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ESDALC6V1M3

Dual low capacitance Transil™ array for ESD protection

STMicroelectronics 

Recommendation on PCB assembly

ESDALC6V1M3

4.5

Reflow profile

Figure 19. ST Ecopack® recommended soldering reflow profile for PCB mounting

Temperature (°C)

260°C max

255°C

220°C

180°C

125 °C

3°C/s max

3°C/s max

2°C/s62r°°eCCc//ossm6mr°emCacx/eosnmmdmeadxended

0

0

1

2

3

4

5

6

7

10-30 sec

Time (min)

90 to 150 sec

90 sec max

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

10/12

Doc ID 11555 Rev 5

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