GS8170DW72C-200 View Datasheet(PDF) - Giga Semiconductor
Part Name
Description
Manufacturer
GS8170DW72C-200 Datasheet PDF : 27 Pages
| |||
GS8170DW36/72C-333/300/250/200
Parameter
TCK Cycle Time
TCK Low to TDO Valid
TCK High Pulse Width
TCK Low Pulse Width
TDI & TMS Set Up Time
TDI & TMS Hold Time
Symbol
tTKC
tTKQ
tTKH
tTKL
tTS
tTH
Min Max Unit
50
—
ns
—
20
ns
20
—
ns
20
—
ns
10
—
ns
10
—
ns
A
aaa
209 BGA Package Drawing (Package C)
14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array
C A1
Side View
D
D1
e
Bottom View
∅b
e
Symbol
Min
Typ
Max Units Symbol
Min
Typ
Max
Units
A
—
—
1.70
mm
D1
—
18.0 (BSC)
—
mm
A1
0.40
0.50
0.60
mm
E
13.9
14.0
14.1
mm
∅b
0.50
0.60
0.70
mm
E1
—
10.0 (BSC)
—
mm
c
0.31
0.36
0.38
mm
e
—
1.00 (BSC)
—
mm
D
21.9
22.0
22.1
mm
aaa
—
0.15
—
mm
Rev 1.0
Rev: 2.04 5/2005
25/27
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology, Inc.
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