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TDA7563PDTR View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
TDA7563PDTR Datasheet PDF : 29 Pages
First Prev 21 22 23 24 25 26 27 28 29
TDA7563PD
9
Package information
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 30. PowerSO36 (slug up) mechanical data and package dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
) A 3.25
3.43 0.128
0.135
t(s A2 3.1
3.2 0.122
0.126
A4 0.8
1 0.031
0.039
c A5
0.2
0.008
u a1 0.030
-0.040 0.0011
-0.0015
d b 0.22
0.38 0.008
0.015
ro ) c 0.23
0.32 0.009
0.012
P t(s D 15.8
16 0.622
0.630
D1 9.4
9.8 0.37
0.38
D2
1
0.039
te c E 13.9
14.5 0.547
0.57
le u E1 10.9
11.1 0.429
0.437
d E2
2.9
0.114
so ro E3 5.8
6.2 0.228
0.244
E4 2.9
3.2 0.114
1.259
b P e
0.65
0.026
e3
11.05
0.435
- O te G
0
0.075 0
0.003
) le H 15.5
15.9 0.61
0.625
h
1.1
0.043
t(s o L
0.8
1.1 0.031
0.043
s N
10˚
10˚
c b s
u O (1) “D and E1” do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.15mm (0.006”)
OObbssoolleettee PPrroodduct(s) - (2)Nointrusionallowedinwardstheleads.
OUTLINE AND
MECHANICAL DATA
PowerSO36 (SLUG UP)
7183931 D
27/29

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