AT91SAM9G46B-CU View Datasheet(PDF) - Atmel Corporation

Part Name

Description

Manufacturer

AT91SAM9G46B-CU

SMART ARM-based Embedded MPU

Atmel Corporation 

Table 49-1. Package Information

Ball Land

Soldering Mask Opening

Solder Mask Definition

0.375 mm +/- 0.05

0.275 mm +/- 0.03

Solder Mask Defined

Table 49-2.

400

Device and 324-ball TFBGA Package Maximum Weight

mg

Table 49-3. 324-ball TFBGA Package Characteristics

Moisture Sensitivity Level

3

Table 49-4. Package Reference

JEDEC Drawing Reference

JESD97 Classification

MO-210

e1

This package respects the recommendations of the NEMI User Group.

49.2 Soldering Profile

Table 49-5 gives the recommended soldering profile from J-STD-020C.

Table 49-5. Soldering Profile

Profile Feature

Average Ramp-up Rate (217°C to Peak)

Preheat Temperature 175°C ±25°C

Temperature Maintained Above 217°C

Time within 5°C of Actual Peak Temperature

Peak Temperature Range

Ramp-down Rate

Time 25°C to Peak Temperature

Note: It is recommended to apply a soldering temperature higher than 250°C.

Green Package

3°C/sec. max.

180 sec. max.

60 sec. to 150 sec.

20 sec. to 40 sec.

260 +0 °C

6°C/sec. max.

8 min. max.

A maximum of three reflow passes is allowed per component.

1244 SAM9G46 Series [DATASHEET]

Atmel-11028G-ATARM-SAM9G46-Datasheet_08-Dec-15

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