EXSC0202-10NF - Embedded & Wirebond Extreme Temperature Silicon Capacitor - MICROSS 데이터시트

Embedded & Wirebond Extreme Temperature Silicon Capacitor

The IPDiA Technology features a Capacitor Integration Capability (up to 250nF/mm2) which allows a capacitance value similar to X8R dielectric, but with better electrical performances than C0G/NP0 dielectrics. 
This technology also offers high reliability, up to 10 times better than alternative capacitor technologies.
This silicon based technology is RoHS compliant and compatible with lead free reflow soldering process.

KEY FEATUREs
• Ultra High Operating Temperature up to 250°C
• Low Profile (250µm)
• High Stability of Capacitance Value;
   • Temperature <±1.5% (-55 to +250°C)
   • Voltage < 0.1 % / V
   • Negligible Capacitance Loss through Ageing
• High Reliability
• Low Leakage Current down to 100pA
• Aluminium Pad Finish

Key Applications
• All Applications up to 250°C, such as Downhole & Defence Industries.
• High Reliability Applications
• Decoupling / Filtering / Charge Pump (ie. Temperature Sensors, Motor Managment)
• Replacement of X8R and C0G Dielectrics
• Downsizing