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MMSZ5243B View Datasheet(PDF) - Formosa Technology

Part Name
Description
Manufacturer
MMSZ5243B
Formosa
Formosa Technology Formosa
MMSZ5243B Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
SMD Zener Diode
Formosa MS
MMSZ5221B THRU MMSZ5267B
Reel packing
PACKAGE
SOD-123F
REEL SIZE
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
3,000
4.0
30,000 183*183*123
REEL
DIA,
(m/m)
178
CARTON
SIZE
(m/m)
382*262*387
CARTON
(pcs)
240,000
APPROX.
GROSS WEIGHT
(kg)
9.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5oC~40oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
Critical Zone
TL to TP
TL
TL
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t25oC to Peak
Time
3.Reflow soldering
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
Tsmax to TL
-Ramp-upRate
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(TP)
Time within 5oC of actual Peak
Temperature(tP)
Ramp-down Rate
Time 25oC to Peak Temperature
Soldering Condition
<3oC/sec
150oC
200oC
60~120sec
<3oC/sec
217oC
60~260sec
255oC-0/+5oC
10~30sec
<6oC/sec
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 8
Document ID
DS-221715
Issued Date
2008/02/10
Revised Date
2010/03/10
Revision
C
Page.
9

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